HSP061-2 データシートの表示（PDF） - STMicroelectronics

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HSP061-2

2-line ESD protection for high speed lines

STMicroelectronics 

HSP061-2

Recommendation on PCB assembly

Figure 19. Recommended stencil window position for µQFN-4L

T=100 µm and opening

ratio is 100%

180 µm

580 µm

0.4

0.4

0.2

1.4

0.2

0.6

0.6

Footprint

Stencil windo w

Footprint

4.2

Solder paste

1. Halide-free flux qualification ROL0 according to ANSI/J-STD-004.

2. “No clean” solder paste is recommended.

3. Offers a high tack force to resist component movement during high speed.

4. Solder paste with fine particles: powder particle size is 20-45 µm.

4.3

Placement

1. Manual positioning is not recommended.

2. It is recommended to use the lead recognition capabilities of the placement system, not

the outline centering.

3. Standard tolerance of ± 0.05 mm is recommended.

4. 3.5 N placement force is recommended. Too much placement force can lead to

squeezed out solder paste and cause solder joints to short. Too low placement force

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