HT1623 データシートの表示（PDF） - Holtek Semiconductor

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HT1623

RAM Mapping 32 x 4 LCD Controller for I/O MCU

Holtek Semiconductor 

Pad Assignment

PATENTED

HT1621/HT1621G

1

48 47 46 45 44 43 42 41 40 39 38 37 36 35 34 33

RD

2

WR

3

D ATA

4

(0 ,0 )

VSS

5

O SCO

6

O SCI 7

V LC D

8

VDD

9

IR Q

10

11

12 13 14 15 16 17 18 19

32 S E G 16

31 S E G 17

30 S E G 18

29 S E G 19

28 S E G 20

27 S E G 21

26 S E G 22

25 S E G 23

24 S E G 24

23 S E G 25

22 S E G 26

21 S E G 27

20 S E G 28

Chip size: 82 ´ 83 (mil)2

Bump height: 18mm ± 3mm

Min. Bump spacing: 23.02mm

Bump size: 76 ´ 76mm2

* The IC substrate should be connected to VDD in the PCB layout artwork.

Rev. 2.90

3

November 9, 2010

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