HT48R005 データシートの表示（PDF） - Holtek Semiconductor
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HT48R005 Datasheet PDF : 62 Pages
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HT48R005/HT46R005
HT46R005
Pin Name
PA0/BZ/AN0
PA1/BZ/AN1
PA2/TMR/INT/AN2
PA5/OSC2
PA6/OSC1
PA7/RES
VDD
VSS
Function OPT I/T O/T
Description
PA0
PAPU
PAWK
ST
CMOS General purpose I/O. Register enabled pull-up and wake-up.
BZ CTRL0 ¾ CMOS Buzzer output pin
AN0 ADCR AN
¾ A/D channel 0
PA1
PAPU
PAWK
ST
CMOS General purpose I/O. Register enabled pull-up and wake-up.
BZ CTRL0 ¾
¾ Buzzer complementary output pin
AN1 ADCR AN
¾ A/D channel 1
PA2
PAPU ST CMOS General purpose I/O. Register enabled pull-up and wake-up.
PAWK
TMR
¾
ST
¾ External Timer clock input
INT
¾
ST
¾ External interrupt input
AN2 ADCR AN
¾ A/D channel 2
PA5
PAPU
PAWK
ST
CMOS General purpose I/O. Register enabled pull-up and wake-up.
OSC2
CO
¾ OSC Oscillator pin
PA6
PAPU ST CMOS General purpose I/O. Register enabled pull-up and wake-up.
PAWK
OSC1
CO OSC ¾ Oscillator pin
PA7 PAWK ST NMOS General purpose I/O. Register enabled wake-up.
RES
CO ST
¾ Reset input
VDD
¾ PWR ¾ Power supply
VSS
¾ PWR ¾ Ground
Note:
I/T: Input type
O/T: Output type
OPT: Optional by configuration option (CO) or register option
PWR: Power
CO: Configuration option
ST: Schmitt Trigger input
CMOS: CMOS output
AN: Analog input pin
Absolute Maximum Ratings
Supply Voltage ...........................VSS-0.3V to VSS+6.0V
Input Voltage..............................VSS-0.3V to VDD+0.3V
IOL Total ..............................................................100mA
Total Power Dissipation .....................................500mW
Storage Temperature ............................-50°C to 125°C
Operating Temperature...........................-40°C to 85°C
IOH Total............................................................-100mA
Note: These are stress ratings only. Stresses exceeding the range specified under ²Absolute Maximum Ratings² may
cause substantial damage to the device. Functional operation of this device at other conditions beyond those listed
in the specification is not implied and prolonged exposure to extreme conditions may affect device reliability.
Rev. 1.20
8
September 26, 2012
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