HT46R46-H データシートの表示（PDF） - Holtek Semiconductor

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HT46R46-H

Cost-Effective A/D Type 8-Bit OTP MCU

Holtek Semiconductor 

HT46R46-H

Pin Description

Pin Name

PA0~PA2

PA3/PFD

PA4/TMR

PA5/INT

PA6, PA7

PB0/AN0

PB1/AN1

PB2/AN2

PB3/AN3

PD0/PWM

I/O Options

Description

Bidirectional 8-bit input/output port. Each bit can be configured as wake-up

Pull-high input by options. Software instructions determine the CMOS output or Schmitt

I/O Wake-up trigger input with or without pull-high resistor (determined by pull-high options: bit

PA3 or PFD option). The PFD, TMR and INT are pin-shared with PA3, PA4 and PA5, re-

spectively.

Bidirectional 4-bit input/output port. Software instructions determine the

CMOS output, Schmitt trigger input with or without pull-high resistor (deter-

I/O Pull-high mined by pull-high options: bit option) or A/D input.

Once a PB line is selected as an A/D input (by using software control), the I/O

function and pull-high resistor are disabled automatically.

Bidirectional I/O line. Software instructions determine the CMOS output,

I/O

Pull-high Schmitt trigger input with or without a pull-high resistor (determined by

PD0 or PWM pull-high options: bit option). The PWM output function is pin-shared with

PD0 (dependent on PWM options).

RES

VDD

VSS

OSC1

OSC2

I

¾

Schmitt trigger reset input. Active low.

¾

¾

Positive power supply

¾

¾

Negative power supply, ground.

I

O

Crystal

or RC

OSC1, OSC2 are connected to an RC network or a Crystal (determined by

options) for the internal system clock. In the case of RC operation, OSC2 is

the output terminal for 1/4 system clock.

Absolute Maximum Ratings

Supply Voltage ...........................VSS-0.3V to VSS+6.0V

Input Voltage..............................VSS-0.3V to VDD+0.3V

Storage Temperature ............................-50°C to 125°C

Operating Temperature.........................-40°C to 125°C

Note: These are stress ratings only. Stresses exceeding the range specified under ²Absolute Maximum Ratings² may

cause substantial damage to the device. Functional operation of this device at other conditions beyond those

listed in the specification is not implied and prolonged exposure to extreme conditions may affect device reliabil-

ity.

Rev. 1.40

3

March 1, 2006

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