HT6740 データシートの表示（PDF） - Holtek Semiconductor
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HT6740 Datasheet PDF : 8 Pages
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Pad Assignment
Pad Assignment
HT6740
Note:
HF 1
NC 2
NC 3
H FI 4
8 VCC
7 VPP
6 C LK
5 GND
H T6740
8 D IP -A
The 8-pin DIP package type is supplied only for
engineering evaluation purposes and will not be
available in production volumes.
HF
1
65
(0 ,0 )
H F1
2
3
4
Chip size: 965´914 (mm)2
* The IC substrate should be connected to VSS in the
PCB layout artwork.
Pad Coordinates
Pad No.
1
2
3
X
-272.025
-272.025
132.225
Y
303.662
-298.538
-314.688
Pad No.
4
5
6
X
266.324
257.400
145.924
Unit: mm
Y
-297.913
312.150
312.112
Pad Description
Pad No. Pad Name
I/O
Internal
Connection
Description
1 HF
I/O
CMOS
Connect to an antenna coil for normal operation. Open for data program-
ming.
2 HF1
I/O
CMOS
Connect to an antenna coil for normal operation. Data I/O for program-
ming.
3 VSS
¾
¾
Negative power supply, ground
4 CLK
I
CMOS Open for normal operation. Clock input for programming.
5 VPP
I
¾
Open for normal operation. High voltage supplies input for programming.
(Suggest 12.5V for programming)
6 VDD
¾
¾
Open for normal operation, +6V supply input for programming.
Absolute Maximum Ratings
Supply Voltage (VDD) ...............................................6V
Supply Voltage (VPA) ..........................................12.5V
Input Voltage .............................VSS-0.3V to VDD+0.3V
Storage Temperature ...........................-50°C to 125°C
Operating Temperature ..............................0°C to 70°C
Note: These are stress ratings only. Stresses exceeding the range specified under ²Absolute Maximum Ratings² may
cause substantial damage to the device. Functional operation of this device at other conditions beyond those
listed in the specification is not implied and prolonged exposure to extreme conditions may affect device reliabil-
ity.
Rev. 1.20
2
May 17, 2007
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