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HT82M22 データシートの表示(PDF) - Holtek Semiconductor

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HT82M22
Holtek
Holtek Semiconductor Holtek
HT82M22 Datasheet PDF : 6 Pages
1 2 3 4 5 6
HT82M22A
Pin Assignment
Pin Description
Pin No. Pin Name
1
VSS
2
V33O
3
USBD+/CLK
4
USBD-/DATA
5
RESET
6, 9
SEL1
SEL0
7
SDIO
8
SCLK(PA5)
10, 11 RB0, RB1
14, 15, 16 L, R, M
12, 13
17
18
19
20
Z1, Z2
LED
VDD
OSC2
OSC1
VSS
V 33O
U S B D + /C L K
U S B D - /D A T A
RESET
S E L1
S D IO
S C LK
S E L0
RB0
1
20
2
19
3
18
4
17
5
16
6
15
7
14
8
13
9
12
10
11
H T82M 22A
2 0 D IP -A
O SC1
O SC2
VDD
LE D
M
R
L
Z2
Z1
RB1
I/O
Description
¾ Negative power supply, ground
O 3.3V voltage output
I/O USB data plus or PS2 Clock, F/W auto-detect USBD+ for USB, CLK for PS2
I/O USB data minus or PS2 Data, F/W auto-detect USB- for USB, DATA for PS2
I Chip reset input, low active
Configuration selections
SEL1=0: Z-axis is divided by 2 (default)
SEL1=1: Z-axis is divided by 4
For ADNS 2051:
I SEL0=0: 800DPI (default)
SEL0=1: 400DPI
For ADNS 2610/2620:
SEL0=0, 400DPI (default)
SEL0=1, 800DPI-by firmware
I/O Serial data for Agilent sensor IC SDIO
I Serial data for Agilent sensor IC SCLK
Click button detection. Input ports with 30kW pull-high resistor.
I Input ports with pull-high resistor. These pads can function as Left, Right, Middle,
B4 and B5 button input lines.
I Z-axis input supports two kinds of scroller input; optomechanical and mechanical.
I/O Drives LED output
¾ 5V positive power supply
O 6MHz OSC output
I 6MHz OSC input
Absolute Maximum Ratings
Supply Voltage ..............................VSS-0.3V to VSS+6V
MCU Input Voltage.....................VSS-0.3V to VDD+0.3V
USB Input Voltage ....................VSS-0.3V to V33O+0.3V
Storage Temperature ............................-50°C to 125°C
Operating Temperature...........................-25°C to 70°C
Note: These are stress ratings only. Stresses exceeding the range specified under ²Absolute Maximum Ratings² may
cause substantial damage to the device. Functional operation of this device at other conditions beyond those
listed in the specification is not implied and prolonged exposure to extreme conditions may affect device reliabil-
ity.
Rev. 1.40
2
September 15, 2005

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