553MI データシートの表示（PDF） - Integrated Circuit Systems
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553MI Datasheet PDF : 6 Pages
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ICS553
LOW SKEW 1 TO 4 CLOCK BUFFER
AC Electrical Characteristics
VDD = 2.5V ±5%, Ambient Temperature -40 to +85 °C, unless stated otherwise
Parameter
Symbol
Conditions
Min. Typ. Max. Units
Input Frequency
0
200 MHz
Output Rise Time
Output Fall Time
Propagation Delay
tOR
tOF
Note 1
0.8 to 2.0V, CL=15pF
2.0 to 0.8V, CL=15pF
1.0 1.5 ns
1.0 1.5 ns
2.2
3
5
ns
Output to output skew
Note 2 Rising edges at VDD/2
0
50
ps
Device to device skew
Rising edges at VDD/2
500 ps
VDD = 3.3V ±5%, Ambient Temperature -40 to +85 °C, unless stated otherwise
Parameter
Symbol
Conditions
Min. Typ. Max. Units
Input Frequency
0
200 MHz
Output Rise Time
Output Fall Time
Propagation Delay
tOR
tOF
Note 1
0.8 to 2.0V, CL=15pF
2.0 to 0.8V, CL=15pF
0.6 1.0 ns
0.6 1.0 ns
2.0
2.4
4
ns
Output to output skew
Note 2 Rising edges at VDD/2
0
50
ps
Device to device skew
Rising edges at VDD/2
500 ps
VDD = 5V ±5%, Ambient Temperature -40 to +85 °C, unless stated otherwise
Parameter
Symbol
Conditions
Min. Typ. Max. Units
Input Frequency
0
200 MHz
Output Rise Time
Output Fall Time
Propagation Delay
tOR
tOF
Note 1
0.8 to 2.0V, CL=15pF
2.0 to 0.8V, CL=15pF
0.3 0.7 ns
0.3 0.7 ns
1.8
2.5
4
ns
Output to output skew
Note 2 Rising edges at VDD/2
0
50
ps
Device to device skew
Rising edges at VDD/2
500 ps
Notes: 1. With rail to rail input clock
2. Between any 2 outputs with equal loading.
3. Duty cycle on outputs will match incoming clock duty cycle. Consult ICS for tight duty cycle clock
generators.
Thermal Characteristics
Parameter
Symbol Conditions
Thermal Resistance Junction to
Ambient
θJA Still air
θJA 1 m/s air flow
θJA 3 m/s air flow
Thermal Resistance Junction to Case θJC
Min.
Typ.
150
140
120
40
Max.
Units
°C/W
°C/W
°C/W
°C/W
MDS 553 H
5
Revision 080404
Integrated Circuit Systems ● 525 Race Street, San Jose, CA 95126 ● tel (408) 295-9800 ● www.icst.com
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