553MI データシートの表示（PDF） - Integrated Circuit Systems
部品番号
コンポーネント説明
メーカー
553MI Datasheet PDF : 6 Pages
| |||
ICS553
LOW SKEW 1 TO 4 CLOCK BUFFER
Package Outline and Package Dimensions (8 pin SOIC, 150 Mil. Narrow Body)
Package dimensions are kept current with JEDEC Publication No. 95
8
INDEX
AREA
12
D
e
B
EH
A
Symbol
A
A1
B
C
D
E
e
H
h
L
α
A1
-C-
SEATING
PLANE
C .10 (.004)
Millimeters
Inches
Min
Max
1.35 1.75
0.10 0.25
0.33 0.51
0.19 0.25
4.80 5.00
3.80 4.00
1.27 BASIC
5.80 6.20
0.25 0.50
0.40 1.27
0°
8°
Min
Max
.0532 .0688
.0040 .0098
.013 .020
.0075 .0098
.1890 .1968
.1497 .1574
0.050 BASIC
.2284 .2440
.010 .020
.016 .050
0°
8°
h x 45
C
L
Ordering Information
Part / Order Number
Marking
ICS553MI
553MI
ICS553MIT
553MI
ICS553MILF
553MILF
ICS553MILFT
553MILF
Shipping Packaging
Tubes
Tape and Reel
Tubes
Tape and Reel
Package
8-pin SOIC
8-pin SOIC
8-pin SOIC
8-pin SOIC
Temperature
-40 to +85 °C
-40 to +85 °C
-40 to +85 °C
-40 to +85 °C
“LF” denotes Pb (lead) free package.
While the information presented herein has been checked for both accuracy and reliability, Integrated Circuit Systems (ICS)
result from its use. No other circuits, patents, or licenses are implied. This product is intended for use in normal commercial
applications. Any other applications such as those requiring extended temperature range, high reliability, or other extraordinary
environmental requirements are not recommended without additional processing by ICS. ICS reserves the right to change any
circuitry or specifications without notice. ICS does not authorize or warrant any ICS product for use in life support devices or
critical medical instruments.
MDS 553 H
6
Revision 080404
Integrated Circuit Systems ● 525 Race Street, San Jose, CA 95126 ● tel (408) 295-9800 ● www.icst.com
Share Link: 