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ILC6377 データシートの表示(PDF) - Fairchild Semiconductor

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ILC6377 Datasheet PDF : 12 Pages
1 2 3 4 5 6 7 8 9 10 Next Last
ILC6376/77
VIN
S/D
EXT1
*CIN +
1
8
2 ILC6376/77 7
3
6
(TOP VIEW)
4
5
CSS
SD1
L
+
CL
VOUT
Fig.2 1Amp output current application
using external MOSFET
The EXT1 and EXT2 pins are provided so as to drive exter-
nal transistors; thus allowing design flexibility. The EXT1
output drive signal has the same timing as the gate drive to
the internal P-channel MOSFET i.e. EXT1 output is low as
long as the internal MOSFET is on. Both EXT1 and EXT2
pins are capable of driving 1000pF gate capacitance. For
example, a high output current application circuit using an
external P-channel MOSFET is shown in figure 2.
To pin 8
6 CFB
5
VOUT
RFB1
RFB2
RFB1 + RFB2 < 2MW
1
CFB chosen so that 1kHz < 2 x π x CFB x RFB1
< 20kHz
Fig.4 Adjustable output using ILC6376/77SOADJ
(Note: rest of circuit is same as Fig.1)
Adjustable Output (ILC6376/77SOADJ)
For adjustable output voltage ILC6376/77SOADJ should be
used. All connections to the ILC6376/77SOADJ are the
same as ILC6376/77SOXX, except for the feedback voltage
divider network shown in figure 4. The output voltage,
VOUT, can be calculated from the following equation:
VOUT = VFB (1 + RFB1/RFB2), where VFB is approximately
1V and RFB1 + RFB2 < 2M
CBST
2200pF
SD2
MBR0520L
Schottky
1
8
2 ILC6376/77 7
3
6
(TOP VIEW)
4
5
Voltage between Vin and
P_BST must be less than 10V.
Figure 3. P-Channel Negative
Boost Circuit
P-Channel Boost Circuit
The ILC6376/77 includes a unique P-Channel MOSFET
architecture with built-in charge pump to maintain low on-
resistance even at low input voltages. As shown in figure 3, a
2200pF ceramic capacitor and a schottky diode (MBR0520L
or equivalent) allows the gate voltage of the internal P-Chan-
nel MOSFET to be driven negative; thus reducing the switch
on-resistance. This technique can be employed to increase
efficiency at low input voltages and high output currents.
Note that the voltage between VIN and P_BST should not
exceed 10V, otherwise damage to the device may occur. For
high input voltage applications the schottky diode should be
replaced by a low voltage zener diode so that the P_BST pin
is clamped to a safe negative voltage.
The feedback compensation capacitor should be chosen such
that the pole frequency f is between 1kHz and 20kHz:
1
1kHz < 2 x π x CFB x RFB1 < 20kHz
The pole frequency should generally be set at 5kHz. The
value of CFB calculated from the above equation may require
some adjustment depending on the output inductor (L) and
output capacitor (CL) values chosen.
Example for 3V output:
RFB1 = 400k
RFB2 = 200k
CFB = 100pF
PC Board Layout
As with all switching DC-DC converter designs, good PC
board layout is critical for optimum performance. The heavy
lines indicated in figure 1 schematic should be wide
printed circuit board traces and should be kept as short
as is practical. A large ground plane with as much copper
area as is allowable should be used. All external components
should be mounted as close to the IC as possible. For
ILC6376/77SOADJ, the feedback resistors and their associ-
ated wiring should be kept away from the inductor location
and the vicinity of inductive flux.
©2001 Fairchild Semiconductor Corporation
7

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