ILD621-X009 データシートの表示（PDF） - Vishay Semiconductors
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ILD621-X009 Datasheet PDF : 10 Pages
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ILD621/ILD621GB/ILQ621/ILQ621GB
Vishay Semiconductors Optocoupler, Phototransistor Output
(Dual, Quad Channel)
ORDER INFORMATION
PART
REMARKS
ILD621-X007
CTR > 50 %, dual, SMD-8 (option 7)
ILD621-X009
CTR > 50 %, dual, SMD-8 (option 9)
ILD621GB-X007
CTR > 100 %, dual, SMD-8 (option 7)
ILQ621-X006
CTR > 50 %, quad, DIP-16 400 mil
ILQ621-X007
CTR > 50 %, quad, SMD-16 (option 7)
ILQ621-X009
CTR > 50 %, quad, SMD-16 (option 9)
ILQ621GB-X006
CTR > 100 %, quad, DIP-16 400 mil
ILQ621GB-X007
CTR > 100 %, quad, SMD-16 (option 7)
ILQ621GB-X009
CTR > 100 %, quad, SMD-16 (option 9)
Note
For additional information on the available options refer to option information.
ABSOLUTE MAXIMUM RATINGS (1)
PARAMETER
TEST CONDITION
PART
SYMBOL
VALUE
UNIT
INPUT
Reverse voltage
Forward current
Surge current
Power dissipation
Derate from 25 °C
VR
IF
IFSM
Pdiss
6.0
V
60
mA
1.5
A
100
mW
1.33
mW/°C
OUTPUT
Collector emitter reverse voltage
Collector current
Power dissipation
Derate from 25 °C
t < 1.0 ms
VECO
IC
IC
Pdiss
70
50
100
150
- 2.0
V
mA
mA
mW
mW/°C
COUPLER
Isolation test voltage
Package dissipation
t = 1.0 s
ILD621
ILD621GB
VISO
5300
400
400
VRMS
mW
mW
Derate from 25 °C
5.33
mW/°C
Package dissipation
ILQ621
ILQ621GB
500
mW
500
mW
Derate from 25 °C
6.67
mW/°C
Creepage distance
≥ 7.0
mm
Clearance distance
≥ 7.0
mm
Isolation resistance
VIO = 500 V, Tamb = 25 °C
VIO = 500 V, Tamb = 100 °C
RIO
≥ 1012
Ω
RIO
≥ 1011
Ω
Storage temperature
Tstg
- 55 to + 150
°C
Operating temperature
Tamb
- 55 to + 100
°C
Junction temperature
Soldering temperature (2)
2.0 mm from case bottom
Tj
100
°C
Tsld
260
°C
Notes
(1) Tamb = 25 °C, unless otherwise specified.
Stresses in excess of the absolute maximum ratings can cause permanent damage to the device. Functional operation of the device is not
implied at these or any other conditions in excess of those given in the operational sections of this document. Exposure to absolute maximum
ratings for extended periods of the time can adversely affect reliability.
(2) Refer to reflow profile for soldering conditions for surface mounted devices (SMD). Refer to wave profile for soldering conditions for through
hole devices (DIP).
www.vishay.com
2
For technical questions, contact: optocoupler.answers@vishay.com
Document Number: 83654
Rev. 1.5, 20-Dec-07
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