L6221A - L6221AD - L6221N
MOUNTING INSTRUCTION
The Rth j-amb of the L6221A can be reduced by sol-
deringthe GND pins to a suitablecopperarea of the
printed circuit board (Fig. 23) or to an external
heatsink (Fig. 24).
The diagram of figure 25 shows the maximum dis-
sipable power Ptot and the Rth j-amb as a function of
the side ” α” of two equal square copper areas hav-
Figure 23 : Example of P.C. Board Copper Area
Which is Used as Heatsink
ing a thickness of 35µ (1.4 mils). During soldering
the pins temperature must not exceed 260 °C and
the soldering time must not be longer than 12 sec-
onds.
The external heatsink or printed circuit copper area
must be connected to electrical ground.
Figure 24 : External Heatsink Mounting Example
Figure 25 : Maximum Dissipable Power and Junc-
tion to Ambient Thermal Resistance
versus Side ” α”
Figure 26 : Maximum Allowable Power Dissipa-
tion versus Ambient Temperature
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