LPC47N217N-JV データシートの表示（PDF） - SMSC -> Microchip

部品番号

コンポーネント説明

メーカー

LPC47N217N-JV

Advanced Notebook I/O Controller with On-Board FLASH

SMSC -> Microchip 

64-Pin Super I/O with LPC Interface

Package Outline

Figure 2 64 Pin TQFP Package Outline, 7X7X1.4 Body, 2 MM Footprint

Table 1 64 Pin TQFP Package Parameters

MIN

NOMINAL

MAX

REMARKS

A

~

~

1.60

A1

0.05

~

0.15

A2

1.35

1.40

1.45

D

8.80

9.00

9.20

D1

6.80

7.00

7.20

E

8.80

9.00

9.20

E1

6.80

7.00

7.20

H

0.09

~

0.20

L

0.45

0.60

0.75

L1

~

1.00 REF.

~

e

0.40 Basic

0o

~

7o

W

0.13

0.18

0.23

ccc

~

~

0.08

Overall Package Height

Standoff

Body Thickness

X Span

X body Size

Y Span

Y body Size

Lead Frame Thickness

Lead Foot Length

Lead Length

Lead Pitch

Lead Foot Angle

Lead Width

Coplanarity

Notes:

1. Controlling Unit: millimeter.

2. Tolerance on the true position of the leads is ± 0.035 mm maximum.

3. Package body dimensions D1 and E1 do not include the mold protrusion.

Maximum mold protrusion is 0.25 mm per side. D1 and E1 dimensions determined at datum plane H.

4. 4 Dimension for foot length L measured at the gauge plane 0.25 mm above the seating plane.

5. 5 Details of pin 1 identifier are optional but must be located within the zone indicated.

SMSC LPC47N217N 64TQFP

5

PRODUCT PREVIEW

Revision 0.2 (09-25-08)

Share Link: