LPC47N237 データシートの表示（PDF） - SMSC -> Microchip

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LPC47N237

3.3v I/O Controller for Port Replicators and Docking Stations

SMSC -> Microchip 

Package Outline

Figure 2 – 100 Pin TQFP Package Outline

Table 1 – 100 Pin TQFP Package Parameters

MIN

NOMINAL

MAX

A

~

~

1.60

A1

0.05

~

0.15

A2

1.35

~

1.45

D

15.80

~

16.20

D1

13.90

~

14.10

E

15.80

~

16.20

E1

13.90

~

14.10

H

0.09

~

0.20

L

0.45

0.60

0.75

L1

~

1.00

~

e

0.50 Basic

θ

0o

~

7o

W

0.17

0.22

0.27

R1

0.08

~

~

R2

0.08

~

0.20

ccc

~

~

0.08

REMARKS

Overall Package Height

Standoff

Body Thickness

X Span

X body Size

Y Span

Y body Size

Lead Frame Thickness

Lead Foot Length

Lead Length

Lead Pitch

Lead Foot Angle

Lead Width

Lead Shoulder Radius

Lead Foot Radius

Coplanarity

Notes:

1. Controlling Unit: millimeter.

2. Tolerance on the position of the leads is ± 0.04 mm maximum.

3. Package body dimensions D1 and E1 do not include the mold protrusion. Maximum mold protrusion is 0.25 mm.

4. Dimension for foot length L measured at the gauge plane 0.25 mm above the seating plane.

5. Details of pin 1 identifier are optional but must be located within the zone indicated.

SMSC DB – LPC47N237

Page 5

PRODUCT PREVIEW

Revision 0.3 (03-30-07)

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