LT1121-5(RevA) データシートの表示（PDF） - Linear Technology
部品番号
コンポーネント説明
メーカー
LT1121-5 Datasheet PDF : 12 Pages
| |||
LT1121/LT1121-3.3/LT1121-5
APPLICATI S I FOR ATIO
taken in still air, on 3/32" FR-4 board with 1oz copper. All
NC leads were connected to the ground plane.
Table 1. N8 Package*
COPPER AREA
THERMAL RESISTANCE
TOPSIDE
BACKSIDE BOARD AREA (JUNCTION-TO-AMBIENT)
2500 sq mm 2500 sq. mm 2500 sq. mm
80°C/ W
1000 sq mm 2500 sq. mm 2500 sq. mm
80°C/ W
225 sq mm 2500 sq. mm 2500 sq. mm
85°C/ W
1000 sq mm 1000 sq. mm 1000 sq. mm
91°C/ W
* Device is mounted on topside. Leads are through hole and are soldered
to both sides of board.
Table 2. S8 Package
COPPER AREA
THERMAL RESISTANCE
TOPSIDE* BACKSIDE BOARD AREA (JUNCTION-TO-AMBIENT)
2500 sq. mm 2500 sq. mm 2500 sq. mm
120°C/ W
1000 sq. mm 2500 sq. mm 2500 sq. mm
120°C/ W
225 sq. mm 2500 sq. mm 2500 sq. mm
25°C/ W
100 sq. mm 1000 sq. mm 1000 sq. mm
131°C/ W
* Device is mounted on topside.
Table 3. AS8 Package*
COPPER AREA
TOPSIDE** BACKSIDE BOARD AREA
2500 sq. mm 2500 sq. mm 2500 sq. mm
1000 sq. mm 2500 sq. mm 2500 sq. mm
225 sq. mm 2500 sq. mm 2500 sq. mm
100 sq. mm 2500 sq. mm 2500 sq. mm
* Pins 3, 6, and 7 are ground.
** Device is mounted on topside.
60°C/ W
60°C/ W
68°C/ W
74°C/ W
Table 4. SOT-223 Package
(Thermal Resistance Junction-to-Tab 20°C/W)
COPPER AREA
THERMAL RESISTANCE
TOPSIDE* BACKSIDE BOARD AREA (JUNCTION-TO-AMBIENT)
2500 sq. mm 2500 sq. mm 2500 sq. mm
50°C/ W
1000 sq. mm 2500 sq. mm 2500 sq. mm
50°C/ W
225 sq. mm 2500 sq. mm 2500 sq. mm
58°C/ W
100 sq. mm 2500 sq. mm 2500 sq. mm
64°C/ W
1000 sq. mm 1000 sq. mm 1000 sq. mm
57°C/ W
1000 sq. mm
0
1000 sq. mm
60°C/ W
* Tab of device attached to topside copper
Table 5. TO-92 Package
THERMAL
RESISTANCE
Package alone
Package soldered into PC board with plated
through holes only
220°C/ W
175°C/ W
Package soldered into PC board with 1/4 sq. inch of
copper trace per lead
145°C/ W
Package soldered into PC board with plated through holes
in board, no extra copper trace, and a clip-on type
heat sink:
Thermalloy type 2224B
Aavid type 5754
160°C/ W
135°C/ W
Calculating Junction Temperature
Example: given an output voltage of 3.3V, an input voltage
range of 4.5V to 7V, an output current range of 0mA to
100mA, and a maximum ambient temperature of 50°C,
what will the maximum junction temperature be?
Power dissipated by the device will be equal to:
IOUT MAX × (VIN MAX – VOUT) + (IGND × VIN)
where, IOUT MAX = 100mA
VIN MAX = 7V
IGND at (IOUT = 100mA, VIN = 7V) = 5mA
so, P = 100mA × (7V – 3.3V) + (5mA × 7V)
= 0.405W
If we use an SOT-223 package, then the thermal resistance
will be in the range of 50°C/W to 65°C/W depending on
copper area. So the junction temperature rise above
ambient will be less than or equal to:
0.405W × 60°C/W = 24°C
The maximum junction temperature will then be equal to
the maximum junction temperature rise above ambient
plus the maximum ambient temperature or:
TJMAX = 50°C + 24°C = 74°C
Output Capacitance and Transient Performance
The LTC1121 is designed to be stable with a wide range of
output capacitors. The minimum recommended value is
1µF with an ESR of 3Ω or less. For applications where
space is very limited, capacitors as low as 0.33µF can be
used if combined with a small series resistor. Assuming
9
Share Link: 