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LT3579IUFD-1-PBF データシートの表示(PDF) - Linear Technology

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LT3579IUFD-1-PBF Datasheet PDF : 40 Pages
First Prev 31 32 33 34 35 36 37 38 39 40
LT3579/LT3579-1
PACKAGE DESCRIPTION
3.86
(.152)
FE Package
20-Lead Plastic TSSOP (4.4mm)
(Reference LTC DWG # 05-08-1663)
Exposed Pad Variation CB
6.40 – 6.60*
(.252 – .260)
3.86
(.152)
20 1918 17 16 15 14 1312 11
6.60 ±0.10
4.50 ±0.10
SEE NOTE 4
2.74
(.108)
0.45 ±0.05
1.05 ±0.10
0.65 BSC
RECOMMENDED SOLDER PAD LAYOUT
4.30 – 4.50*
(.169 – .177)
0.25
REF
0° – 8°
2.74
(.108)
6.40
(.252)
BSC
1 2 3 4 5 6 7 8 9 10
1.20
(.047)
MAX
0.09 – 0.20
(.0035 – .0079)
0.50 – 0.75
(.020 – .030)
NOTE:
1. CONTROLLING DIMENSION: MILLIMETERS
2.
DIMENSIONS
ARE
IN
MILLIMETERS
(INCHES)
3. DRAWING NOT TO SCALE
0.65
(.0256)
BSC
0.195 – 0.30
(.0077 – .0118)
TYP
0.05 – 0.15
(.002 – .006)
FE20 (CB) TSSOP 0204
4. RECOMMENDED MINIMUM PCB METAL SIZE
FOR EXPOSED PAD ATTACHMENT
*DIMENSIONS DO NOT INCLUDE MOLD FLASH. MOLD FLASH
SHALL NOT EXCEED 0.150mm (.006") PER SIDE
35791f
38

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