LT5520 データシートの表示（PDF） - Linear Technology

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LT5520

1.3GHz to 2.3GHz High Linearity Upconverting Mixer

Linear Technology 

PACKAGE DESCRIPTIO

LT5520

4.35 ± 0.05

2.15 ± 0.05

2.90 ± 0.05 (4 SIDES)

UF Package

16-Lead Plastic QFN (4mm × 4mm)

(Reference LTC DWG # 05-08-1692)

0.72 ±0.05

4.00 ± 0.10

(4 SIDES)

PIN 1

TOP MARK

0.75 ± 0.05

BOTTOM VIEW—EXPOSED PAD

R = 0.115

TYP

15 16

0.55 ± 0.20

1

2

2.15 ± 0.10

(4-SIDES)

PACKAGE

OUTLINE

0.30 ±0.05

0.65 BCS

RECOMMENDED SOLDER PAD PITCH AND DIMENSIONS

0.200 REF

0.00 – 0.05

NOTE:

1. DRAWING CONFORMS TO JEDEC PACKAGE OUTLINE MO-220 VARIATION (WGGC)

2. ALL DIMENSIONS ARE IN MILLIMETERS

3. DIMENSIONS OF EXPOSED PAD ON BOTTOM OF PACKAGE DO NOT INCLUDE

MOLD FLASH. MOLD FLASH, IF PRESENT, SHALL NOT EXCEED 0.15mm ON ANY SIDE

4. EXPOSED PAD SHALL BE SOLDER PLATED

(UF) QFN 0802

0.30 ± 0.05

0.65 BSC

Information furnished by Linear Technology Corporation is believed to be accurate and reliable.

However, no responsibility is assumed for its use. Linear Technology Corporation makes no represen-

tation that the interconnection of its circuits as described herein will not infringe on existing patent rights.

5520f

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