LTC1726IS8-2.5(RevB) データシートの表示（PDF） - Linear Technology
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LTC1726IS8-2.5
(Rev.:RevB)
(Rev.:RevB)
Linear Technology
LTC1726IS8-2.5 Datasheet PDF : 12 Pages
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PACKAGE DESCRIPTIO
MS8 Package
8-Lead Plastic MSOP
(Reference LTC DWG # 05-08-1660)
0.889 ± 0.127
(.035 ± .005)
5.23
(.206)
MIN
3.2 – 3.45
(.126 – .136)
0.42 ± 0.04
(.0165 ± .0015)
TYP
0.65
(.0256)
BSC
RECOMMENDED SOLDER PAD LAYOUT
3.00 ± 0.102
(.118 ± .004)
(NOTE 3)
8 7 65
0.52
(.206)
REF
0.254
(.010)
DETAIL “A”
0° – 6° TYP
4.90 ± 0.15
(1.93 ± .006)
3.00 ± 0.102
(.118 ± .004)
NOTE 4
GAUGE PLANE
0.53 ± 0.015
(.021 ± .006)
DETAIL “A”
1 234
1.10
(.043)
MAX
0.18
(.077)
SEATING
PLANE 0.22 – 0.38
NOTE:
1. DIMENSIONS IN MILLIMETER/(INCH)
(.009 – .015)
TYP
0.65
(.0256)
BSC
2. DRAWING NOT TO SCALE
3. DIMENSION DOES NOT INCLUDE MOLD FLASH, PROTRUSIONS OR GATE BURRS.
MOLD FLASH, PROTRUSIONS OR GATE BURRS SHALL NOT EXCEED 0.152mm (.006") PER SIDE
4. DIMENSION DOES NOT INCLUDE INTERLEAD FLASH OR PROTRUSIONS.
INTERLEAD FLASH OR PROTRUSIONS SHALL NOT EXCEED 0.152mm (.006") PER SIDE
5. LEAD COPLANARITY (BOTTOM OF LEADS AFTER FORMING) SHALL BE 0.102mm (.004") MAX
0.86
(.034)
REF
0.13 ± 0.076
(.005 ± .003)
MSOP (MS8) 0802
S8 Package
8-Lead Plastic Small Outline (Narrow .150 Inch)
(Reference LTC DWG # 05-08-1610)
.050 BSC
.045 ±.005
.189 – .197
(4.801 – 5.004)
NOTE 3
8
7
6
5
.245
MIN
.160 ±.005
.228 – .244
(5.791 – 6.197)
.150 – .157
(3.810 – 3.988)
NOTE 3
.030 ±.005
TYP
RECOMMENDED SOLDER PAD LAYOUT
1
2
.010
(0.254
–
–
.020
0.508)
×
45°
.008 – .010
(0.203 – 0.254)
0°– 8° TYP
.053 – .069
(1.346 – 1.752)
.016 – .050
(0.406 – 1.270)
NOTE:
1. DIMENSIONS
IN
INCHES
(MILLIMETERS)
.014 – .019
(0.355 – 0.483)
TYP
2. DRAWING NOT TO SCALE
3. THESE DIMENSIONS DO NOT INCLUDE MOLD FLASH OR PROTRUSIONS.
MOLD FLASH OR PROTRUSIONS SHALL NOT EXCEED .006" (0.15mm)
34
.004 – .010
(0.101 – 0.254)
.050
(1.270)
BSC
SO8 0303
Information furnished by Linear Technology Corporation is believed to be accurate and reliable.
However, no responsibility is assumed for its use. Linear Technology Corporation makes no represen-
tation that the interconnection of its circuits as described herein will not infringe on existing patent rights.
LTC1726
1726fb
11
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