LTC4357 データシートの表示（PDF） - Linear Technology
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LTC4357 Datasheet PDF : 12 Pages
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PACKAGE DESCRIPTION
DCB Package
6-Lead Plastic DFN (2mm × 3mm)
(Reference LTC DWG # 05-08-1715 Rev A)
0.70 p0.05
2.00 p0.10
(2 SIDES)
LTC4357
R = 0.115
R = 0.05
TYP
TYP
4
0.40 p 0.10
6
3.55 p0.05
1.65 p0.05
(2 SIDES)
2.15 p0.05
PACKAGE PIN 1 BAR
OUTLINE TOP MARK
(SEE NOTE 6)
0.25 p 0.05
0.50 BSC
1.35 p0.05
(2 SIDES)
RECOMMENDED SOLDER PAD PITCH AND DIMENSIONS
0.200 REF
NOTE:
1. DRAWING TO BE MADE A JEDEC PACKAGE OUTLINE M0-229 VARIATION OF (TBD)
2. DRAWING NOT TO SCALE
3. ALL DIMENSIONS ARE IN MILLIMETERS
4. DIMENSIONS OF EXPOSED PAD ON BOTTOM OF PACKAGE DO NOT INCLUDE
MOLD FLASH. MOLD FLASH, IF PRESENT, SHALL NOT EXCEED 0.15mm ON ANY SIDE
5. EXPOSED PAD SHALL BE SOLDER PLATED
6. SHADED AREA IS ONLY A REFERENCE FOR PIN 1 LOCATION ON THE
TOP AND BOTTOM OF PACKAGE
3.00 p0.10 1.65 p 0.10
(2 SIDES) (2 SIDES)
0.75 p0.05
0.00 – 0.05
PIN 1 NOTCH
R0.20 OR 0.25
s 45o CHAMFER
3
1
(DCB6) DFN 0405
0.25 p 0.05
0.50 BSC
1.35 p0.10
(2 SIDES)
BOTTOM VIEW—EXPOSED PAD
MS8 Package
8-Lead Plastic MSOP
(Reference LTC DWG # 05-08-1660 Rev F)
3.00 p 0.102
(.118 p .004)
(NOTE 3)
8 7 65
0.52
(.0205)
REF
0.889 p 0.127
(.035 p .005)
0.254
(.010)
DETAIL “A”
0o – 6o TYP
4.90 p 0.152
(.193 p .006)
5.23
(.206)
MIN
3.20 – 3.45
(.126 – .136)
GAUGE PLANE
0.42 p 0.038
(.0165 p .0015)
TYP
0.65
(.0256)
BSC
RECOMMENDED SOLDER PAD LAYOUT
0.18
(.007)
0.53 p 0.152
(.021 p .006)
DETAIL “A”
SEATING
PLANE
NOTE:
1. DIMENSIONS IN MILLIMETER/(INCH)
2. DRAWING NOT TO SCALE
3. DIMENSION DOES NOT INCLUDE MOLD FLASH, PROTRUSIONS OR GATE BURRS.
MOLD FLASH, PROTRUSIONS OR GATE BURRS SHALL NOT EXCEED 0.152mm (.006") PER SIDE
4. DIMENSION DOES NOT INCLUDE INTERLEAD FLASH OR PROTRUSIONS.
INTERLEAD FLASH OR PROTRUSIONS SHALL NOT EXCEED 0.152mm (.006") PER SIDE
5. LEAD COPLANARITY (BOTTOM OF LEADS AFTER FORMING) SHALL BE 0.102mm (.004") MAX
1 234
1.10
(.043)
MAX
0.22 – 0.38
(.009 – .015)
TYP
0.65
(.0256)
BSC
Information furnished by Linear Technology Corporation is believed to be accurate and reliable.
However, no responsibility is assumed for its use. Linear Technology Corporation makes no representa-
tion that the interconnection of its circuits as described herein will not infringe on existing patent rights.
3.00 p 0.102
(.118 p .004)
(NOTE 4)
0.86
(.034)
REF
0.1016 p 0.0508
(.004 p .002)
MSOP (MS8) 0307 REV F
4357fb
11
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