LTC6800 データシートの表示（PDF） - Linear Technology

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LTC6800

Rail-to-Rail, Input and Output, Instrumentation Amplifier

Linear Technology 

Package Description

DD Package

8-Lead Plastic DFN (3mm × 3mm)

(Reference LTC DWG # 05-08-1698 Rev C)

LTC6800

0.70 p0.05

3.5 p0.05

1.65 p0.05

2.10 p0.05 (2 SIDES)

PACKAGE

OUTLINE

0.25 p 0.05

0.50

BSC

2.38 p0.05

RECOMMENDED SOLDER PAD PITCH AND DIMENSIONS

APPLY SOLDER MASK TO AREAS THAT ARE NOT SOLDERED

R = 0.125

TYP

5

0.40 p 0.10

8

PIN 1

TOP MARK

(NOTE 6)

0.200 REF

3.00 p0.10

(4 SIDES)

1.65 p 0.10

(2 SIDES)

0.75 p0.05

0.00 – 0.05

4

0.25 p 0.05

(DD8) DFN 0509 REV C

1

0.50 BSC

2.38 p0.10

BOTTOM VIEW—EXPOSED PAD

NOTE:

1. DRAWING TO BE MADE A JEDEC PACKAGE OUTLINE M0-229 VARIATION OF (WEED-1)

2. DRAWING NOT TO SCALE

3. ALL DIMENSIONS ARE IN MILLIMETERS

4. DIMENSIONS OF EXPOSED PAD ON BOTTOM OF PACKAGE DO NOT INCLUDE

MOLD FLASH. MOLD FLASH, IF PRESENT, SHALL NOT EXCEED 0.15mm ON ANY SIDE

5. EXPOSED PAD SHALL BE SOLDER PLATED

6. SHADED AREA IS ONLY A REFERENCE FOR PIN 1 LOCATION

ON TOP AND BOTTOM OF PACKAGE

6800fb

11

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