LTM4609V データシートの表示（PDF） - Linear Technology
部品番号
コンポーネント説明
メーカー
LTM4609V Datasheet PDF : 28 Pages
| |||
LTM4609
Absolute Maximum Ratings
(Note 1)
VIN.............................................................. –0.3V to 36V
VOUT.............................................................. 0.8V to 36V
INTVCC, EXTVCC, RUN, SS, PGOOD............... –0.3V to 7V
SW1, SW2 (Note 7)....................................... –5V to 36V
VFB............................................................. –0.3V to 2.4V
COMP........................................................... –0.3V to 2V
FCB, STBYMD........................................ –0.3V to INTVCC
PLLIN......................................................... –0.3V to 5.5V
PLLFLTR..................................................... –0.3V to 2.7V
INTVCC................................................................. –40mA
Operating Temperature Range (Note 2)
E- and I-grades.....................................–40°C to 85°C
MP-grade............................................ –55°C to 125°C
Junction Temperature............................................ 125°C
Storage Temperature Range....................–55°C to 125°C
Solder Temperature (Note 3).................................. 245°C
Pin Configuration (See Table 6 Pin Assignment)
TOP VIEW
SW2
(BANK 2)
M
L
SW1
(BANK 4) K
VIN
(BANK 1)
J
VOUT H
(BANK 5)
G
INTVCC
EXTVCC F
E
RSENSE
(BANK 3)
PGND D
(BANK 6) C
PGOOD
VFB B
A
SENSE– SS SGND RUN FCB
COMP
PLLFLTR
PLLIN
1 2 3 4 5 6 7 8 9 10 11 12
SENSE+
STBYMD
LGA PACKAGE
141-LEAD (15mm × 15mm × 2.82mm)
TJMAX = 125°C, θJA = 11.4°C/W, θJCtop = 15°C/W, θJCbottom = 4°C/W, WEIGHT = 1.5g
TOP VIEW
SW2
(BANK 2)
M
L
SW1
(BANK 4) K
VIN
(BANK 1)
J
VOUT H
(BANK 5)
G
INTVCC
EXTVCC F
E
RSENSE
(BANK 3)
PGND D
(BANK 6) C
PGOOD
VFB B
A
SENSE– SS SGND RUN FCB
COMP
PLLFLTR
PLLIN
1 2 3 4 5 6 7 8 9 10 11 12
SENSE+
STBYMD
BGA PACKAGE
141-LEAD (15mm × 15mm × 3.42mm)
TJMAX = 125°C, θJA = 11.4°C/W, θJCtop = 15°C/W, θJCbottom = 4°C/W, WEIGHT = 1.7g
Order Information
PART NUMBER
LTM4609EV#PBF
LTM4609IV#PBF
LTM4609MPV#PBF
LTM4609EY#PBF
LTM4609IY#PBF
LTM4609IY
LTM4609MPY #PBF
LTM4609MPY
PAD OR BALL FINISH
Au (RoHS)
Au (RoHS)
Au (RoHS)
SAC305 (RoHS)
SAC305 (RoHS)
SnPb (63/37)
SAC305 (RoHS)
SnPb (63/37)
PART MARKING*
DEVICE
FINISH CODE
LTM4609V
e4
LTM4609V
e4
LTM4609V
e4
LTM4609Y
e1
LTM4609Y
e1
LTM4609Y
e0
LTM4609Y
e1
LTM4609Y
e0
PACKAGE
TYPE
LGA
LGA
LGA
BGA
BGA
BGA
BGA
BGA
MSL
RATING
3
3
3
3
3
3
3
3
TEMPERATURE RANGE
(Note 2)
–40°C to 85°C
–40°C to 85°C
–55°C to 125°C
–40°C to 85°C
–40°C to 85°C
–40°C to 85°C
–55°C to 125°C
–55°C to 125°C
Consult Marketing for parts specified with wider operating temperature
ranges. *Device temperature grade is indicated by a label on the shipping
container. Pad or ball finish code is per IPC/JEDEC J-STD-609.
• Pb-free and Non-Pb-free Part Markings:
www.linear.com/leadfree
• Recommended LGA and BGA PCB Assembly and Manufacturing
Procedures:
www.linear.com/umodule/pcbassembly
• LGA and BGA Package and Tray Drawings:
www.linear.com/packaging
4609ff
2
For more information www.linear.com/LTM4609
Share Link: 