LX1553IM データシートの表示（PDF） - Microsemi Corporation
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LX1553IM Datasheet PDF : 18 Pages
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PRODUCT DATABOOK 1996/1997
LX1552/3/4/5
ULTRA-LOW START-UP CURRENT, CURRENT-MODE PWM
PRODUCTION DATA SHEET
A B S O L U T E M A X I M U M R AT I N G S (Note 1)
Supply Voltage (Low Impedance Source) .................................................................. 30V
Supply Voltage (I < 30mA) ......................................................................... Self Limiting
CC
Output Current ............................................................................................................. ±1A
Output Energy (Capacitive Load) ................................................................................ 5µJ
Analog Inputs (Pins 2, 3) ........................................................................... -0.3V to +6.3V
Error Amp Output Sink Current ............................................................................... 10mA
Power Dissipation at T = 25°C (DIL-8) ...................................................................... 1W
A
Operating Junction Temperature
Ceramic (Y Package) ............................................................................................ 150°C
Plastic (M, DM, D, PW Packages) ........................................................................ 150°C
Storage Temperature Range .................................................................... -65°C to +150°C
Lead Temperature (Soldering, 10 Seconds) ............................................................ 300°C
Note 1. Exceeding these ratings could cause damage to the device. All voltages are with respect
to Ground. Currents are positive into, negative out of the specified terminal. Pin
numbers refer to DIL packages only.
T H E R M A L D ATA
M PACKAGE:
THERMAL RESISTANCE-JUNCTION TO AMBIENT, θJA
DM PACKAGE:
95°C/W
THERMAL RESISTANCE-JUNCTION TO AMBIENT, θJA
D PACKAGE:
165°C/W
THERMAL RESISTANCE-JUNCTION TO AMBIENT, θJA
Y PACKAGE:
120°C/W
THERMAL RESISTANCE-JUNCTION TO AMBIENT, θJA
PW PACKAGE:
130°C/W
THERMAL RESISTANCE-JUNCTION TO AMBIENT, θJA
144°C/W
Junction Temperature Calculation: T = T + (P x θ ).
J
A
D
JA
The θ numbers are guidelines for the thermal performance of the device/pc-board system.
JA
All of the above assume no ambient airflow
PACKAGE PIN OUTS
COMP 1
VFB
2
ISENSE
3
RT/CT 4
8
VREF
7
VCC
6 OUTPUT
5 GND
M & Y PACKAGE
(Top View)
COMP
VFB
ISENSE
RT/CT
1
8
VREF
2
7
VCC
3
6
OUTPUT
4
5
GND
DM PACKAGE
(Top View)
COMP
N.C.
VFB
N.C.
ISENSE
N.C.
RT/CT
1
14
VREF
2
13
N.C.
3
12
VCC
4
11
VC
5
10
OUTPUT
6
9
GND
7
8
PWR GND
D PACKAGE
(Top View)
N.C.
N.C.
COMP
VFB
N.C.
ISENSE
N.C.
RT/CT
N.C.
N.C.
1
20
2
19
3
18
4
17
5
16
6
15
7
14
8
13
9
12
10
11
PW PACKAGE
(Top View)
N.C.
N.C.
VREF
N.C.
VCC
VC
OUTPUT
GND
PWR GND
N.C.
2
Copyright © 1994
Rev. 1.0a 1/01
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