LX5510LQ データシートの表示（PDF） - Microsemi Corporation
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LX5510LQ Datasheet PDF : 9 Pages
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LX5510
TM
®
InGaP HBT 2.4 – 2.5 GHz Power Amplifier
PRODUCTION DATA SHEET
ABSOLUTE MAXIMUM RATINGS
DC Supply Voltage, RF off ...............................................................................6V
Collector Current ........................................................................................400mA
Total Power Dissipation....................................................................................2W
RF Input Power........................................................................................... 15dBm
Operation Ambient Temperature ...................................................-40°C to +85°C
Storage Temperature....................................................................-65°C to +150°C
Peak Package Solder Reflow Temp. (40 seconds maximum exposure) ........ 260°C (+0, -5)
Note: Exceeding these ratings could cause damage to the device. All voltages are with respect to
Ground. Currents are positive into, negative out of specified terminal.
x denotes respective pin designator 1, 2, or 3
THERMAL DATA
LQ Plastic MLPQ 16-Pin
THERMAL RESISTANCE-JUNCTION TO CASE, θJC
THERMAL RESISTANCE-JUNCTION TO AMBIENT, θJA
10°C/W
50°C/W
PACKAGE PIN OUT
VC2
RF OUT
RF OUT
N/C
13 14 15 16
12
*1
11
2
1
0
3
9
4
87 65
N/C
RF IN
RF IN
N/C
* Pad is Ground
LQ PACKAGE
(Bottom View)
N/C = No connect
RoHS / Pb-free 100% Matte Tin Lead Finish
Name
RF IN
VB1
VB2
VCC
RF OUT
VC1
VC2
GND
FUNCTIONAL PIN DESCRIPTION
Description
RF input. This pin is DC-shorted to GND but AC-coupled to the transistor base of the first stage.
Bias current control voltage for the first stage.
Bias current control voltage for the second stage. The VB2 pin can be connected with the first stage control
voltage (VB1) into a single reference voltage (referred to as Vref) through an external resistor bridge.
Supply voltage for the bias reference and control circuits. This pin can be combined with both VC1 and VC2 pins,
resulting in a single supply voltage (referred to as Vc).
RF output.
Power supply for first stage amplifier. The VC1 feedline should be terminated with a 3.3 pF bypass capacitor,
followed by a 8.2 nH blocking inductor at the supply side.
Power supply for second stage amplifier. The VC2 feedline should be driven with a 8.2 nH AC blocking inductor
and 1 uF bypass capacitor.
The center metal base of the MLP package provides both DC and RF ground as well as heat sink for the power
amplifier.
Copyright © 2000
Rev. 1.0d 2005-08-18
Microsemi
Integrated Products Division
11861 Western Avenue, Garden Grove, CA. 92841, 714-898-8121, Fax: 714-893-2570
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