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M25PE40-VMW6P データシートの表示(PDF) - Numonyx -> Micron

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M25PE40-VMW6P Datasheet PDF : 62 Pages
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Description
1
Description
M25PE40
The M25PE40 is a 4 Mbit (512Kbit × 8 bit) serial paged Flash memory accessed by a high
speed SPI-compatible bus.
The memory can be written or programmed 1 to 256 bytes at a time, using the Page Write or
Page Program instruction. The Page Write instruction consists of an integrated Page Erase
cycle followed by a Page Program cycle.
The memory is organized as 8 sectors that are further divided up into 16 subsectors each
(128 subsectors in total). Each sector contains 256 pages and each subsector contains 16
pages. Each page is 256 bytes wide. Thus, the whole memory can be viewed as consisting
of 2048 pages, or 524,288 bytes.
The memory can be erased a page at a time, using the Page Erase instruction, a subsector
at a time, using the Subsector Erase instruction, a sector at a time, using the Sector Erase
instruction or as a whole, using the Bulk Erase (BE) instruction.
The memory can be write protected by either hardware or software using a mix of volatile
and non-volatile protection features, depending on the application needs. The protection
granularity is of 64 Kbytes (sector granularity).
Important note
This datasheet details the functionality of the devices, based on the previous T7X process or
based on the current T9HX process (available since July 2007). Delivery of parts operating
with a maximum clock rate of 75 MHz starts from week 8 of 2008.
What are the changes?
The M25PE40 in T9HX process offers the following additional features:
the whole memory array is partitioned into 4-Kbyte subsectors
five new instructions: Write Status Register (WRSR), Write to Lock Register (WRLR),
Read Lock Register (RDLR), 4-Kbyte Subsector Erase (SSE) and Bulk Erase (BE)
Status Register: 4 bits can be written (BP0, BP1, BP2, SRWD)
WP input (pin 3): write protection limits are extended, depending on the value of the
BP0, BP1, BP2, SRWD bits. The WP write protection remains the same if bits (BP2,
BP1, BP0) are set to (0, 0, 1)
smaller die size allowing assembly into an SO8N package.
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