M29W008EB データシートの表示（PDF） - STMicroelectronics

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M29W008EB

8 Mbit (1Mb x 8, Boot Block) 3V Supply Flash Memory

STMicroelectronics 

1 Summary description

1 Summary description

M29W008ET, M29W008EB

The M29W008E is a 8 Mbit (1Mb x 8) non-volatile Flash memory that can be read, erased at

block, multi-block or chip level and programmed at Byte level. These operations are performed

using a single 2.7V to 3.6V VCC supply voltage. For Program and Erase operations the

necessary high voltages are generated internally. The device can also be programmed using

standard programming equipment.

The memory is divided into blocks that are asymmetrically arranged. Both M29W008ET and

M29W008EB devices have an array of 19 blocks composed of one Boot Block of 16 KBytes,

two Parameter Blocks of 8 KBytes, one Main Block of 32 KBytes and fifteen Main Blocks of 64

KBytes. In the M29W008ET, the Boot Block is located at the top of the memory address space

while in the M29W008EB, it is located at the bottom. The memory maps are showed in

Figure 4: Block Addresses (Top Boot Block) and Figure 5: Block Addresses (Bottom Boot

Block). Each block can be erased and reprogrammed independently so it is possible to

preserve valid data while old data is erased. Program and Erase commands are written to the

Command Interface of the memory. An on-chip Program/Erase Controller simplifies the

process of programming or erasing the memory by taking care of all of the special operations

that are required to update the memory contents. The end of a program or erase operation can

be detected and any error conditions identified. Erase operations in one block can be

temporarily suspended in order to read from or program in blocks that are not being erased.

Each block can be programmed and erased over 100,000 cycles.

Each block can be protected independently to prevent accidental Program or Erase commands

from modifying the memory. All previously protected blocks can be temporarily unprotected.

In order to meet environmental requirements, ST offers this device in a TSOP40 (10 x 20mm)

ECOPACK® package. ECOPACK® packages are Lead-free and RoHS compliant. The category

of second Level Interconnect is marked on the package and on the inner box label, in

compliance with JEDEC Standard JESD97. The maximum ratings related to soldering

conditions are also marked on the inner box label. ECOPACK is an ST trademark. ECOPACK

specifications are available at: www.st.com.

The device is offered in package and supplied with all the bits erased (set to ’1’).

Table 1.

A0-A19

Signal Names

Address Inputs

DQ0-DQ7

Data Input/Outputs, Command Inputs

E

Chip Enable

G

Output Enable

W

Write Enable

RP

Reset/Block Temporary Unprotect

RB

Ready/Busy Output

VCC

Supply Voltage

VSS

Ground

NC

Not Connected Internally

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