MAS9187AUA4 データシートの表示（PDF） - Micro Analog systems
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MAS9187AUA4 Datasheet PDF : 7 Pages
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PACKAGE (TSSOP-20) OUTLINES
e/ 2
A
VIEW B-B
b
DA9187.002
29 January, 2004
INDEX AREA
E
E1
c1
c
b1
GAUGE PLANE
12° REF
S
R
A
e
D
0.25
L
12° REF
L1
A A2
A1
b
b
B
B
VIEW A-A
Symbol
Min
Nom
Max
Unit
A
--
--
1.10
mm
A1
0.05
--
0.15
mm
A2
0.85
0.90
0.95
mm
b
0.19
--
0.30
mm
b1
0.19
0.22
0.25
mm
c
0.09
--
0.20
mm
c1
0.09
--
0.16
mm
D
6.40
6.50
6.60
mm
E
6.4 BSC
mm
E1
4.30
4.40
4.50
mm
e
0.65 BSC
mm
L
0.50
0.60
0.75
mm
L1
1.00 REF
R
0.09
--
--
mm
S
--
0.20
--
mm
Dimensions do not include mold or interlead flash, protrusions or gate burrs.
Reference Standard : JEDEC MO-153 .
SOLDERING INFORMATION
Resistance to Soldering Heat
Maximum Temperature
Maximum Number of Reflow Cycles
Reflow profile
Seating Plane Co-planarity
Lead Finish
According to RSH test IEC 68-2-58/20 2*220°C
240°C
2
Thermal profile parameters stated in JESD22-A113 should not
be exceeded. http://www.jedec.org
max 0.08 mm
Solder plate 7.62 - 25.4 µm, material Sn 85% Pb 15%
6 (7)
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