MAT01N データシートの表示（PDF） - Analog Devices

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MAT01N

Matched Monolithic Dual Transistor

Analog Devices 

MAT01

ABSOLUTE MAXIMUM RATINGS1

Collector-Base Voltage (BVCBO)

MAT01AH, GH, N . . . . . . . . . . . . . . . . . . . . . . . . . . . 45 V

Collector-Emitter Voltage (BVCEO)

MAT01AH, GH, N . . . . . . . . . . . . . . . . . . . . . . . . . . . 45 V

Collector-Collector Voltage (BVCC)

MAT01AH, GH, N . . . . . . . . . . . . . . . . . . . . . . . . . . . 45 V

Emitter-Emitter Voltage (BVEE)

MAT01AH, GH, N . . . . . . . . . . . . . . . . . . . . . . . . . . . 45 V

Emitter-Base Voltage (BVEBO)2 . . . . . . . . . . . . . . . . . . . . . 5 V

Collector Current (IC) . . . . . . . . . . . . . . . . . . . . . . . . . .25 mA

Emitter Current (IE) . . . . . . . . . . . . . . . . . . . . . . . . . . 25 mA

Total Power Dissipation

Case Temperature ≤ 40°C3 . . . . . . . . . . . . . . . . . . . . 1.8 W

Ambient Temperature ≤ 70°C4 . . . . . . . . . . . . . . . 500 mW

Operating Ambient Temperature . . . . . . . . . –55°C to +125°C

Operating Junction Temperature . . . . . . . . . –55°C to +150°C

Storage Temperature . . . . . . . . . . . . . . . . . . –65°C to +150°C

Lead Temperature (Soldering, 60 sec) . . . . . . . . . . . . +300°C

DICE Junction Temperature . . . . . . . . . . . . –65°C to +150°C

NOTES

1Absolute maximum ratings apply to both DICE and packaged devices.

2Application of reverse bias voltages in excess of rating shown can result in

degradation of hFE and hFE matching characteristics. Do not attempt to measure

BVEBO greater than the 5 V rating shown.

3Rating applies to applications using heat sinking to control case temperature.

Derate linearity at 16.4 mW/°C for case temperatures above 40°C.

4Rating applies to applications not using heat sinking; device in free air only. Derate

linearity at 6.3 mW/°C for ambient temperatures above 70°C.

ORDERING GUIDE1

Model

MAT01AH2

MAT01GH

VOS max

(TA = +25؇C)

0.1 mV

0.5 mV

Temperature

Range

–55°C to +125°C

–55°C to +125°C

Package

Option

TO-78

TO-78

NOTES

1Burn-in is available on commercial and industrial temperature range parts in

TO-can packages.

2For devices processed in total compliance to MIL-STD-883, add/883 after part

number. Consult factory for 883 data sheet.

DICE CHARACTERISTICS

DIE SIZE 0.035 × 0.025 inch, 875 sq. mils

(0.89 × 0.64 mm, 0.58 sq. mm)

1. COLLECTOR (1)

2. BASE (1)

3. EMITTER (1)

5. EMITTER (2)

6. BASE (2)

7. COLLECTOR (2)

CAUTION

ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily

accumulate on the human body and test equipment and can discharge without detection.

Although the MAT01 features proprietary ESD protection circuitry, permanent damage may

occur on devices subjected to high energy electrostatic discharges. Therefore, proper ESD

precautions are recommended to avoid performance degradation or loss of functionality.

WARNING!

ESD SENSITIVE DEVICE

–4–

REV. A

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