MAX883CSA データシートの表示（PDF） - Maxim Integrated

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MAX883CSA

5V/3.3V or Adjustable, Low-Dropout, Low IQ, 200mA Linear Regulators

Maxim Integrated 

5V/3.3V or Adjustable, Low-Dropout,

Low IQ, 200mA Linear Regulators

1.6

MAX883, VOUT = 5V

1.5 8-PIN SO PACKAGE

77.4cm2,

1.4 SINGLE-SIDED BOARD

1oz. COPPER

1.3

GLASS EPOXY,

TJ = +125°C,

TA = +25°C, STILL AIR

1.2

1.1

1.0

0.9

0.1cm2

0.0155in2

1cm2

0.155in2

10cm2

1.55in2

100cm2

15.5in2

COPPER GROUND PAD AREA

250

MAXIMUM POWER

MAXIMUM CURRENT DISSIPATION LIMIT

200

HIGH-

150

POWER

SOIC

PLASTIC DIP

100

CERAMIC DIP

50

OPERATING

REGION AT

TA = +25°C

TJ = +125°C

0

2 3 4 5 6 7 8 9 10 11 12 13

SUPPLY VOLTAGE (V)

Figure 4. Typical Maximum Power Dissipation vs. Ground

Pad Area

Figure 5a. Safe Operating Regions: MAX882/MAX884 Maximum

Output Current vs. Supply Voltage

The GND pins of the MAX882/MAX883/MAX884 SOIC

package perform the dual function of providing an elect-

rical connection to ground and channeling heat away. Con-

nect all GND pins to ground using a large pad or ground

plane. Where this is impossible, place a copper plane on an

adjacent layer. For a given power dissipation, the pad

should exceed the associated dimensions in Figure 4.

Figure 4 assumes the IC is in an 8-pin small-outline pack-

age that has a maximum junction temperature of +125°C

and is soldered directly to the pad; it also has a +25°C

ambient air temperature and no other heat sources. Use

larger pad sizes for other packages, lower junction tem-

peratures, higher ambient temperatures, or conditions

where the IC is not soldered directly to the heat-sinking

ground pad. When operating C and E grade parts up to a

TJ of +125°C, expect performance similar to M grade

specifications. For TJ between +125°C and +150°C, the

output voltage may drift more.

The MAX882/MAX883/MAX884 can regulate currents up

to 250mA and operate with input voltages up to 11.5V, but

not simultaneously. High output currents can only be sus-

tained when input-output differential voltages are small, as

shown in Figure 5. Maximum power dissipation depends

on packaging, temperature, and air flow. The maximum

output current is as follows:

IOUT(MAX)

=

(VIN

P(TJ − TA )

− VOUT)100°C

where P is derived from Figure 4.

250

MAXIMUM POWER

DISSIPATION LIMIT

MAXIMUM CURRENT

200

HIGH-

POWER

150

SOIC

PLASTIC DIP

100

50

0

4

CERAMIC DIP

OPERATING

REGION AT

TA = +25°C

TJ = +125°C

5 6 7 8 9 10 11 12 13

SUPPLY VOLTAGE (V)

Figure 5b. Safe Operating Regions: MAX883 Maximum Output

Current vs. Supply Voltage

10 ______________________________________________________________________________________

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