MBR835, MBR840, MBR845
THERMAL CHARACTERISTICS
Characteristic
Symbol
Thermal Resistance − Junction−to−Lead
(See Note 2 − Mounting Data)
Thermal Resistance − Junction−to−Ambient
(See Note 2 − Mounting Data)
RθJL
RθJA
ELECTRICAL CHARACTERISTICS (TL = 25°C unless otherwise noted)
Characteristic
Maximum Instantaneous Forward Voltage (Note 1)
(iF = 8.0 Amps, TL = 25°C)
Maximum Instantaneous Reverse Current @ Rated dc Voltage (Note 1)
TL = 25°C
TL = 100°C
1. Pulse Test: Pulse Width = 300 μs, Duty Cycle = 2.0%.
0.9 in x 0.9 in
Copper Pad Size
13
50
6.75 in x 6.75 in
Copper Pad Size
12
40
Symbol
vF
iR
Max
0.55
1.0
50
Unit
°C/W
Unit
V
mA
30
30
10
10
1
125°C
100°C
75°C
25°C
0.1
0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8
VF, INSTANTANEOUS VOLTAGE (VOLTS)
Figure 1. Typical Forward Voltage
MBR845
1
100°C
125°C
75°C
25°C
0.1
0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8
VF, INSTANTANEOUS VOLTAGE (VOLTS)
Figure 2. Maximum Forward Voltage
1E−01
1E−02
1E−03
1E−04
1E−05
125°C
100°C
75°C
25°C
10,000
1000
1E−06
0
5 10 15 20 25 30 35 40 45 50
VR, REVERSE VOLTAGE (VOLTS)
Figure 3. Typical Reverse Current
100
0.1
f = 1 MHz
TJ = 25°C
1
10
100
VR, REVERSE VOLTAGE (VOLTS)
Figure 4. Typical Capacitance
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