MC100ELT28 データシートの表示（PDF） - ON Semiconductor
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MC100ELT28 Datasheet PDF : 9 Pages
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MC10ELT28, MC100ELT28
DECL 1
DECL 2
PECL
QECL 3
8 VCC
7 QTTL
TTL
6 DTTL
QECL 4
5 GND
Figure 1. 8−Lead Pinout (Top View) and Logic
Diagram
Table 1. PIN DESCRIPTION
Pin
Function
QTTL
TTL Outputs
DTTL
TTL Data Inputs
QECL, QECL
PECL Differential Outputs
DECL, DECL
PECL Differential Inputs
VCC
GND
Positive Supply
Ground
EP
Exposed pad must be connected to a
sufficient thermal conduit. Electrically
connect to the most negative supply or
leave floating open.
Table 2. ATTRIBUTES
Characteristics
ESD Protection
Human Body Model
Moisture Sensitivity, Indefinite Time Out of Drypack (Note 1)
SOIC−8
TSSOP−8
DFN8
Flammability Rating
Oxygen Index: 28 to 34
Transistor Count
Meets or exceeds JEDEC Spec EIA/JESD78 IC Latchup Test
1. For additional information, see Application Note AND8003/D.
Value
> 2 kV
Pb Pkg
Pb−Free Pkg
Level 1
Level 1
Level 1
Level 1
Level 3
Level 1
UL 94 V−0 @ 0.125 in
71 Devices
Table 3. MAXIMUM RATINGS
Symbol
Parameter
Condition 1
Condition 2
Rating
Unit
VCC
Positive Power Supply
VIN
Input Voltage
Iout
PECL Output Current
GND = 0 V
GND = 0 V
Continuous
Surge
VI VCC
7
V
0 to 6
V
50
mA
100
mA
TA
Operating Temperature Range
Tstg
Storage Temperature Range
qJA
Thermal Resistance (Junction−to−Ambient)
0 lfpm
500 lfpm
SOIC−8
SOIC−8
−40 to +85
−65 to +150
190
130
°C
°C
°C/W
°C/W
qJC
Thermal Resistance (Junction−to−Case)
Standard Board
qJA
Thermal Resistance (Junction−to−Ambient)
0 lfpm
500 lfpm
SOIC−8
TSSOP−8
TSSOP−8
41 to 44
185
140
°C/W
°C/W
°C/W
qJC
Thermal Resistance (Junction−to−Case)
Standard Board
qJA
Thermal Resistance (Junction−to−Ambient)
0 lfpm
500 lfpm
TSSOP−8
DFN8
DFN8
41 to 44 ± 5%
129
84
°C/W
°C/W
°C/W
Tsol
Wave Solder
Pb <2 to 3 sec @ 248°C
Pb−Free <2 to 3 sec @ 260°C
265
°C
265
Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the
Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect
device reliability.
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