MC100LVEP210
PACKAGE DIMENSIONS
32 LEAD LQFP
CASE 873A−02
ISSUE C
A
A1
32
4X
0.20 (0.008) AB T−U Z
25
1
−T−
B
B1
8
9
−AB−
SEATING
PLANE
−AC−
DETAIL Y
−U−
V
17 V1
AE
P
AE
DETAIL Y
9
−Z−
4X
S1
0.20 (0.008) AC T−U Z
S
8X M_
R
DETAIL AD
G
CE
BASE
METAL
ÉÉÉÉF ÉÉÉÉN D
J
SECTION AE−AE
0.10 (0.004) AC
NOTES:
1. DIMENSIONING AND TOLERANCING
PER ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION:
MILLIMETER.
3. DATUM PLANE −AB− IS LOCATED AT
BOTTOM OF LEAD AND IS COINCIDENT
WITH THE LEAD WHERE THE LEAD
EXITS THE PLASTIC BODY AT THE
BOTTOM OF THE PARTING LINE.
4. DATUMS −T−, −U−, AND −Z− TO BE
DETERMINED AT DATUM PLANE −AB−.
5. DIMENSIONS S AND V TO BE
DETERMINED AT SEATING PLANE −AC−.
6. DIMENSIONS A AND B DO NOT INCLUDE
MOLD PROTRUSION. ALLOWABLE
PROTRUSION IS 0.250 (0.010) PER SIDE.
DIMENSIONS A AND B DO INCLUDE
MOLD MISMATCH AND ARE
DETERMINED AT DATUM PLANE −AB−.
7. DIMENSION D DOES NOT INCLUDE
DAMBAR PROTRUSION. DAMBAR
PROTRUSION SHALL NOT CAUSE THE
D DIMENSION TO EXCEED 0.520 (0.020).
8. MINIMUM SOLDER PLATE THICKNESS
SHALL BE 0.0076 (0.0003).
9. EXACT SHAPE OF EACH CORNER MAY
VARY FROM DEPICTION.
W
H
K Q_
X
DETAIL AD
MILLIMETERS
INCHES
DIM MIN MAX MIN MAX
A 7.000 BSC
0.276 BSC
A1 3.500 BSC
0.138 BSC
B 7.000 BSC
0.276 BSC
B1 3.500 BSC
0.138 BSC
C 1.400 1.600 0.055 0.063
D 0.300 0.450 0.012 0.018
E 1.350 1.450 0.053 0.057
F 0.300 0.400 0.012 0.016
G 0.800 BSC
0.031 BSC
H 0.050 0.150 0.002 0.006
J 0.090 0.200 0.004 0.008
K 0.450 0.750 0.018 0.030
M
12_ REF
12_ REF
N 0.090 0.160 0.004 0.006
P 0.400 BSC
0.016 BSC
Q
1_
5_ 1_
5_
R 0.150 0.250 0.006 0.010
S 9.000 BSC
0.354 BSC
S1 4.500 BSC
0.177 BSC
V 9.000 BSC
0.354 BSC
V1 4.500 BSC
0.177 BSC
W 0.200 REF
0.008 REF
X 1.000 REF
0.039 REF
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