MC100EP142FA データシートの表示（PDF） - ON Semiconductor
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MC100EP142FA Datasheet PDF : 13 Pages
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MC10EP142, MC100EP142
Table 11. AC CHARACTERISTICS VCC = 3.0 V to 5.5 V; VEE = 0.0 V or VCC = 0.0 V; VEE = −3.0 V to −5.5 V (Note 26)
−40°C
25°C
85°C
Symbol
Characteristic
Min Typ Max Min Typ Max Min Typ Max
fSHIFT
tPLH,
tPHL
Maximum Shift Frequency
Propagation Delay to Output
2.8
CLKx 500 625 750 550 675 800 575 700 825
MR 500 625 750 550 675 800 575 700 825
ts
Setup Time
D 50 −50
SEL 100 50
50 −50
100 50
50 −50
100 50
th
Hold Time
D 100 50
SEL 50 −50
100 50
50 −50
100 50
50 −50
tRR
tpw
tSKEW
Reset Recovery Time
Minimum Pulse Width
Within-Device Skew (Note 27)
Duty Cycle Skew (Note 28)
Q, Q
50 100
5.0 20
800
200
50 100
5.0 20
50 100
5.0 20
tJITTER
Vinpp
Random Clock Jitter (Figure 4)
Input Voltage Swing/Sensitivity
(Differential Configuration)
1
2
1
2
1
2
150 800 1200 150 800 1200 150 800 1200
tr,
Rise/Fall Times @ 50 MHz
tf
(20 - 80%)
110 180 250 125 190 275 150 215 300
Unit
GHz
ps
ps
ps
ps
ps
ps
ps
mV
ps
NOTE: Device will meet the specifications after thermal equilibrium has been established when mounted in a test socket or printed circuit
board with maintained transverse airflow greater than 500 lfpm. Electrical parameters are guaranteed only over the declared
operating temperature range. Functional operation of the device exceeding these conditions is not implied. Device specification limit
values are applied individually under normal operating conditions and not valid simultaneously.
26. Measured using a 750 mV source, 50% duty cycle clock source. All loading with 50 W to VCC − 2.0 V.
27. Within-device skew is defined as identical transitions on similar paths through a device.
28. Skew is measured between outputs under identical transitions. Duty cycle skew is defined only for differential operation when the delays
are measured from the cross point of the inputs to the cross point of the outputs.
900
9
800
8
700
7
600
6
500
5
400
300
200
10ÉÉ00 ÉÉÉÉÉÉÉÉÉÉÉÉÉÉÉÉ
234ÉÉÉÉÉÉ
1
0
1000
2000
3000
4000
5000
6000
INPUT FREQUENCY (MHz)
Figure 4. Output Voltage Amplitude / RMS Jitter vs.
Input Frequency at Ambient Temperature (Typical)
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