MC33164-3 データシートの表示（PDF） - Microsemi Corporation
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MC33164-3 Datasheet PDF : 9 Pages
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PRODUCT DATABOOK 1996/1997
MC33164-3/MC34164-3
3V UNDERVOLTAGE SENSING CIRCUIT
PRODUCTION DATA SHEET
A B S O L U T E M A X I M U M R AT I N G S (Note 1)
Input Supply Voltage (V ) ............................................................................... -1V to 12V
IN
RESET Output Voltage (VOUT) ..................................................................................... 12V
Output Sink Current (I ) ............................................................ Internally Limited (mA)
OL
Clamp Diode Forward Current (IF), Pin 1 to pin 2 ............................................... 100mA
Operating Junction Temperature
Plastic (DM, LP - Packages) .................................................................................. 150°C
Storage Temperature Range ...................................................................... -65°C to 150°C
Lead Temperature (Soldering, 10 seconds) ............................................................. 300°C
Peak Package Solder Reflow Temp. (40 second max. exposure).......................................... 260°C (+0, -5)
Note 1. Values beyond which damage may occur. All voltages are specified with respect to
ground, and all currents are positive into the specified terminal.
THERMAL DATA
DM PACKAGE:
THERMAL RESISTANCE-JUNCTION TO AMBIENT, θJA
LP PACKAGE:
165°C/W
THERMAL RESISTANCE-JUNCTION TO AMBIENT, θJA
156°C/W
Junction Temperature Calculation: T = T + (P x θ ).
J
A
D
JA
The θJA numbers are guidelines for the thermal performance of the device/pc-board system.
All of the above assume no ambient airflow
BLOCK DIAGRAM
VIN
PACKAGE PIN OUTS
RESET
VIN
N.C.
GROUND
18
N.C.
27
N.C.
36
N.C.
45
N.C.
DM PACKAGE
(Top View)
RoHS / Pb-free 100% Matte Tin Lead Finish
3. GROUND
2. VIN
1. RESET
LP PACKAGE
(Top View)
RESET
1.2 VREF
GROUND
2
Copyright © 1999
Rev. 1.2a 11/04
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