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MC33365(2006) データシートの表示(PDF) - ON Semiconductor

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MC33365
(Rev.:2006)
ON-Semiconductor
ON Semiconductor ON-Semiconductor
MC33365 Datasheet PDF : 11 Pages
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MC33365
shortcircuit protection. This output requires an external
bypass capacitor of at least 1.0 μF for stability.
Thermal Shutdown and Package
Internal thermal circuitry is provided to protect the Power
Switch in the event that the maximum junction temperature
is exceeded. When activated, typically at 150°C, the Latch
is forced into a ‘reset’ state, disabling the Power Switch. The
Latch is allowed to ‘set’ when the Power Switch temperature
falls below 140°C. This feature is provided to prevent
catastrophic failures from accidental device overheating. It
is not intended to be used as a substitute for proper
heatsinking.
The MC33365 is contained in a heatsinkable plastic
dualinline package in which the die is mounted on a
special heat tab copper alloy lead frame. This tab consists of
the four center ground pins that are specifically designed to
improve thermal conduction from the die to the circuit
board. Figure 16 shows a simple and effective method of
utilizing the printed circuit board medium as a heat
dissipater by soldering these pins to an adequate area of
copper foil. This permits the use of standard layout and
mounting practices while having the ability to halve the
junction to air thermal resistance. The examples are for a
symmetrical layout on a singlesided board with two ounce
per square foot of copper.
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