MC33998 データシートの表示（PDF） - Freescale Semiconductor

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MC33998

Switching Power Supply with Linear Regulators

Freescale Semiconductor 

ELECTRICAL CHARACTERISTICS

MAXIMUM RATINGS

ELECTRICAL CHARACTERISTICS

MAXIMUM RATINGS

Table 2. Maximum Ratings

All voltages are with respect to ground unless otherwise noted.

Rating

Symbol

Value

Unit

Main Supply Voltage

Keep-Alive Supply Voltage

Switching Node

5.0 V Input Power

Sensor Supply

Keep-Alive Supply Voltage

Maximum Voltage at Logic I/O Pins

VPWR

-0.3 to 45

V

KA_VPWR

-0.3 to 45

V

VSW

-0.5 to 45

V

VDDH

-0.3 to 6.0

V

VREF1

VREF2

-0.3 to 18

V

-0.3 to 18

VKAM

-0.3 to 6.0

V

EN

-0.3 to 6.0

V

SNSEN

-0.3 to 6.0

PWROK

-0.3 to 6.0

VKAMOK

-0.3 to 6.0

Charge Pump Reservoir Capacitor Voltage

Error Amplifier Summing Node

Switching Regulator Output Feedback

CRES

VSUM

FBKB

-0.3 to 18

V

-0.3 to 6.0

V

-0.3 to 6.0

V

VDDL Base Drive

DRVL

-0.3 to 6.0

V

VDDL Feedback

FBL

-0.3 to 6.0

V

ESD Voltage

Human Body Model (all pins) (1)

Machine Model (all pins) (1)

VESD1

VESD2

V

±500

±100

Power Dissipation (TA = 25°C) (2)

Thermal Resistance, Junction to Ambient (3), (4)

Thermal Resistance, Junction to Board (5)

Operational Package Temperature [Ambient Temperature] (6)

PD

RθJA

RθJB

TA

800

60

20

-40 to 125

mW

°C/W

°C/W

°C

Notes

1. ESD1 testing is performed in accordance with the Human Body Model (CZAP=100 pF, RZAP=1500 Ω). ESD2 testing is performed in

accordance with the Machine Model (CZAP=200 pF, RZAP=0 Ω)

2. Maximum power dissipation at indicated junction temperature.

3. Junction temperature is a function of on-chip power dissipation, package thermal resistance, mounting site (board) temperature,

ambient temperature, air flow, power dissipation of other components on the board, and board thermal resistance.

4. Per SEMI G38-87 and JEDEC JESD51-2 with the single layer board horizontal.

5. Thermal resistance between the die and the printed circuit board per JEDEC JESD51-8. Board temperature is measured on the top

surface of the board near the package.

6. The limiting factor is junction temperature, taking into account the power dissipation, thermal resistance, and heat sinking.

33998

5

Analog Integrated Circuit Device Data

Freescale Semiconductor

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