MC33064LP データシートの表示（PDF） - Microsemi Corporation

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MC33064LP

UNDERVOLTAGE SENSING CIRCUIT

Microsemi Corporation 

PRODUCT DATABOOK 1996/1997

MC33064/MC34064

TRANSIENT IMMUNE UNDERVOLTAGE SENSING CIRCUIT

PRODUCTION DATA SHEET

A B S O L U T E M A X I M U M R AT I N G S (Note 1)

Input Supply Voltage (V ) ............................................................................... -1V to 10V

IN

RESET Output Voltage (VOUT) ..................................................................................... 10V

Output Sink Current (I ) ............................................................ Internally Limited (mA)

OL

Clamp Diode Forward Current (IF), Pin 1 to pin 2 ............................................... 100mA

Operating Junction Temperature

Plastic (DM, LP - Packages) .................................................................................. 150°C

Storage Temperature Range ...................................................................... -65°C to 150°C

Lead Temperature (Soldering, 10 seconds) ............................................................. 300°C

Note 1. Values beyond which damage may occur. All voltages are specified with respect to

ground, and all currents are positive into the specified terminal.

THERMAL DATA

DM PACKAGE:

THERMAL RESISTANCE-JUNCTION TO AMBIENT, θJA

LP PACKAGE:

165°C/W

THERMAL RESISTANCE-JUNCTION TO AMBIENT, θJA

156°C/W

Junction Temperature Calculation: T = T + (P x θ ).

J

A

D

JA

The θJA numbers are guidelines for the thermal performance of the device/pc-board system.

All of the above assume no ambient airflow

BLOCK DIAGRAM

VIN

PACKAGE PIN OUTS

RESET

VIN

N.C.

GROUND

18

27

36

45

N.C.

N.C.

N.C.

N.C.

DM PACKAGE

(Top View)

3. GROUND

2. VIN

1. RESET

LP PACKAGE

(Top View)

RESET

1.2 VREF

GROUND

2

Copyright © 1999

Rev. 1.3 6/99

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