56F8165(2007) データシートの表示（PDF） - Freescale Semiconductor
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56F8165 Datasheet PDF : 172 Pages
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Thermal Design Considerations
Table 11-2 56F8165 128-Pin LQFP Package Identification by Pin Number (Continued)
Pin No.
29
30
31
32
Signal Name
GPIOB2
GPIOB3
GPIOB4
PWMB0
Pin No.
61
62
63
64
Signal Name
NC
VDD_IO
NC
NC
Pin No.
93
94
95
96
Signal Name
VREFH
VDDA_ADC
VSSA_ADC
ANB0
Pin No.
125
126
127
128
Signal Name
MISO0
MOSI0
PHASEA0
PHASEB0
NOTES:
1. DIMENSIONING AND TOLERANCING PER ASME
Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DATUM PLANE H IS LOCATED AT BOTTOM OF LEAD
AND IS COINCIDENT WITH THE LEAD WHERE THE
LEAD EXITS THE PLASTIC BODY AT THE BOTTOM OF
MILLIMETERS
DIM MIN
MAX
A
---
1.60
A1 0.05
0.15
A2 1.35
1.45
b 0.17
0.27
b1 0.17
0.23
c 0.09
0.20
c1 0.09
0.16
D
22.00 BSC
D1
20.00BSC
e
0.50 BSC
E
16.00 BSC
E1
14.00 BSC
L 0.45
0.75
L1
1.00 REF
L2
0.50 REF
S 0.20
---
R1 0.08
---
R2 0 08
0 20
56F8365 Technical Data, Rev. 7
Freescale Semiconductor
171
Preliminary
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