MC74LVX139DR2G データシートの表示（PDF） - ON Semiconductor
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MC74LVX139DR2G Datasheet PDF : 8 Pages
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MC74LVX139
DEVICE
UNDER
TEST
OUTPUT
TEST POINT
CL*
*Includes all probe and jig capacitance
Figure 8. Test Circuit
ORDERING INFORMATION
Device
Package
Shipping†
MC74LVX139DR2
SOIC−16
2500 Tape & Reel
MC74LVX139DR2G
SOIC−16
(Pb−Free)
2500 Tape & Reel
MC74LVX139DTR2
TSSOP−16*
2500 Tape & Reel
MC74LVX139M
SOEIAJ−16
50 Units / Rail
MC74LVX139MG
SOEIAJ−16
(Pb−Free)
50 Units / Rail
MC74LVX139MEL
SOEIAJ−16
2000 Tape & Reel
MC74LVX139MELG
SOEIAJ−16
(Pb−Free)
2000 Tape & Reel
†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging
Specifications Brochure, BRD8011/D.
*This package is inherently Pb−Free.
EMBOSSED CARRIER DIMENSIONS (See Notes 6 and 7)
Tape B1
Size Max
D
D1
E
F
K
P
P0
P2
R
T
W
8 mm 4.35 mm
(0.179”)
12 mm 8.2 mm
(0.323”)
1.5 mm
+ 0.1
−0.0
(0.059”
+0.004
−0.0)
1.0 mm
Min
(0.179”)
1.5 mm
Min
(0.060)
1.75 mm
±0.1
(0.069
±0.004”)
3.5 mm
±0.5
(1.38
±0.002”)
5.5 mm
±0.5
(0.217
±0.002”)
2.4 mm
Max
(0.094”)
6.4 mm
Max
(0.252”)
4.0 mm
±0.10
(0.157
±0.004”)
4.0 mm
±0.10
(0.157
±0.004”)
8.0 mm
±0.10
(0.315
±0.004”)
4.0 mm
±0.1
(0.157
±0.004”)
2.0 mm
±0.1
(0.079
±0.004”)
25 mm
(0.98”)
30 mm
(1.18”)
0.6 mm
(0.024)
8.3 mm
(0.327)
12.0 mm
±0.3
(0.470
±0.012”)
16 mm 12.1 mm
(0.476”)
7.5 mm
±0.10
(0.295
±0.004”)
7.9 mm
Max
(0.311”)
4.0 mm
±0.10
(0.157
±0.004”)
8.0 mm
±0.10
(0.315
±0.004”)
12.0 mm
±0.10
(0.472
±0.004”)
16.3 mm
(0.642)
24 mm 20.1 mm
(0.791”)
11.5 mm
±0.10
(0.453
±0.004”)
11.9 mm
Max
(0.468”)
16.0 mm
±0.10
(0.63
±0.004”)
24.3 mm
(0.957)
6. Metric Dimensions Govern−English are in parentheses for reference only.
7. A0, B0, and K0 are determined by component size. The clearance between the components and the cavity must be within 0.05 mm min to
0.50 mm max. The component cannot rotate more than 10° within the determined cavity
http://onsemi.com
5
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