MC74VHC1G86 データシートの表示（PDF） - ON Semiconductor

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MC74VHC1G86

Single 2-Input Exclusive OR Gate

ON Semiconductor 

MC74VHC1G86, MC74VHC1GT86

PACKAGE DIMENSIONS

SC−74A

CASE 318BQ

ISSUE B

5X b

0.20 C A B

5

4

E1

E

123

B

e

A

D

TOP VIEW

A

M

0.05

A1

L

DETAIL A

DETAIL A

SIDE VIEW

C

SEATING

PLANE

c END VIEW

NOTES:

1. DIMENSIONING AND TOLERANCING PER ASME

Y14.5M, 1994.

2. CONTROLLING DIMENSION: MILLIMETERS.

3. MAXIMUM LEAD THICKNESS INCLUDES LEAD FINISH

THICKNESS. MINIMUM LEAD THICKNESS IS THE

MINIMUM THICKNESS OF BASE MATERIAL.

4. DIMENSIONS A AND B DO NOT INCLUDE MOLD

FLASH, PROTRUSIONS, OR GATE BURRS. MOLD

FLASH, PROTRUSIONS, OR GATE BURRS SHALL NOT

EXCEED 0.15 PER SIDE.

MILLIMETERS

DIM MIN MAX

A 0.90 1.10

A1 0.01 0.10

b 0.25 0.50

c 0.10 0.26

D 2.85 3.15

E 2.50 3.00

E1 1.35 1.65

e

0.95 BSC

L 0.20 0.60

M

0 _ 10 _

RECOMMENDED

SOLDERING FOOTPRINT*

0.95

PITCH

2.40

5X

1.00

5X

0.70

DIMENSIONS: MILLIMETERS

*For additional information on our Pb−Free strategy and soldering

details, please download the ON Semiconductor Soldering and

Mounting Techniques Reference Manual, SOLDERRM/D.

www.onsemi.com

9

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