MJF15030 データシートの表示（PDF） - ON Semiconductor
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MJF15030 Datasheet PDF : 6 Pages
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MJF15030 (NPN), MJF15031 (PNP)
TEST CONDITIONS FOR ISOLATION TESTS*
FULLY ISOLATED PACKAGE
LEADS
HEATSINK
0.110, MIN
Figure 11. Mounting Position
*Measurement made between leads and heatsink with all leads shorted together.
MOUNTING INFORMATION
4-40 SCREW
CLIP
PLAIN WASHER
HEATSINK
COMPRESSION WASHER
NUT
HEATSINK
Figure 12. Typical Mounting Techniques*
Laboratory tests on a limited number of samples indicate, when using the screw and compression washer mounting technique, a screw torque of 6 to
8 in . lbs is sufficient to provide maximum power dissipation capability. The compression washer helps to maintain a constant pressure on the package
over time and during large temperature excursions.
Destructive laboratory tests show that using a hex head 4−40 screw, without washers, and applying a torque in excess of 20 in . lbs will cause the
plastic to crack around the mounting hole, resulting in a loss of isolation capability.
Additional tests on slotted 4−40 screws indicate that the screw slot fails between 15 to 20 in . lbs without adversely affecting the package. However,
in order to positively ensure the package integrity of the fully isolated device, ON Semiconductor does not recommend exceeding 10 in . lbs of mount-
ing torque under any mounting conditions.
** For more information about mounting power semiconductors see Application Note AN1040.
http://onsemi.com
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