MM3Z10VT1G(2012) データシートの表示（PDF） - ON Semiconductor

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MM3Z10VT1G
(Rev.:2012)

Zener Voltage Regulators

ON Semiconductor 

MM3ZxxxT1G Series,

SZMM3ZxxxT1G Series

Zener Voltage Regulators

200 mW SOD−323 Surface Mount

This series of Zener diodes is packaged in a SOD−323 surface

mount package that has a power dissipation of 200 mW. They are

designed to provide voltage regulation protection and are especially

attractive in situations where space is at a premium. They are well

suited for applications such as cellular phones, hand held portables,

and high density PC boards.

Specification Features:

 Standard Zener Breakdown Voltage Range − 2.4 V to 75 V

 Steady State Power Rating of 200 mW

 Small Body Outline Dimensions:

0.067” x 0.049” (1.7 mm x 1.25 mm)

 Low Body Height: 0.035” (0.9 mm)

 Package Weight: 4.507 mg/Unit

 ESD Rating of Class 3 (> 16 kV) per Human Body Model

 AEC−Q101 Qualified and PPAP Capable − SZMM3ZxxxT1G

 SZ Prefix for Automotive and Other Applications Requiring Unique

Site and Control Change Requirements

 These are Pb−Free Devices*

Mechanical Characteristics:

CASE: Void-free, Transfer-Molded Plastic

FINISH: All External Surfaces are Corrosion Resistant

MAXIMUM CASE TEMPERATURE FOR SOLDERING PURPOSES:

260C for 10 Seconds

LEADS: Plated with Pb−Sn or Sn Only (Pb−Free)

POLARITY: Cathode Indicated by Polarity Band

FLAMMABILITY RATING: UL 94 V−0

MOUNTING POSITION: Any

MAXIMUM RATINGS

Rating

Symbol

Max

Unit

Total Device Dissipation FR−5 Board,

(Note 1) @ TA = 25C

Derate above 25C

PD

200

mW

1.5

mW/C

Thermal Resistance, Junction−to−Ambient RqJA

635

C/W

Junction and Storage Temperature Range TJ, Tstg −65 to +150 C

Stresses exceeding Maximum Ratings may damage the device. Maximum

Ratings are stress ratings only. Functional operation above the Recommended

Operating Conditions is not implied. Extended exposure to stresses above the

Recommended Operating Conditions may affect device reliability.

1. FR−4 Minimum Pad

*For additional information on our Pb−Free strategy and soldering details, please

download the ON Semiconductor Soldering and Mounting Techniques

Reference Manual, SOLDERRM/D.

 Semiconductor Components Industries, LLC, 2012

1

January, 2012 − Rev. 9

http://onsemi.com

SOD−323

CASE 477

STYLE 1

1

Cathode

2

Anode

MARKING DIAGRAM

xx G

G

xx = Specific Device Code

M = Date Code*

G = Pb−Free Package

(Note: Microdot may be in either location)

*Date Code orientation may vary depending

upon manufacturing location.

ORDERING INFORMATION

Device

Package

Shipping†

MM3ZxxxT1G

SOD−323

(Pb−Free)

3,000 /

Tape & Reel

SZMM3ZxxxT1G SOD−323

(Pb−Free)

3,000 /

Tape & Reel

†For information on tape and reel specifications,

including part orientation and tape sizes, please

refer to our Tape and Reel Packaging Specifications

Brochure, BRD8011/D.

DEVICE MARKING INFORMATION

See specific marking information in the device marking

column of the Electrical Characteristics table on page 2 of

this data sheet.

Publication Order Number:

MM3Z2V4T1/D

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