Table 4. AC Characteristics (VDD = 3.3 V ± 5%; Ambient Temperature = –40°C to 85°C)
Parameter
Symbol
Condition
Min
Typ
Max
Unit
Input Frequency
Output Frequency(1)
0
15 pF load
160
MHz
160
MHz
Output Clock Rise Time
Output Clock Fall Time
Propagation Delay(2)
Output to Output Skew(3)
tOR
0.8 V to 2.0 V
tOF
2.0 V to 0.8 V
135 MHz
1.5
ns
1.5
ns
1.5
4
5
ns
Rising edges at VDD/2
300
ps
1. Measured with an external series resistor of 33Ω positioned close to each output pin
2. Measured with rail to rail input clock
3. Measured between any 2 outputs with equal loading
PACKAGE DIMENSIONS
A
D
8
E
1
5
H
4
0.25 M B M
B
e
C
h X 45˚
θ
A
SEATING
PLANE
0.10
A1
B
0.25 M C B S A S
C
L
D/EF SUFFIX
SOIC PACKAGE
CASE 751-06
ISSUE T
NOTES:
1. DIMENSIONING AND TOLERANCING PER ASME
Y14.5M, 1994.
2. DIMENSIONS ARE IN MILLIMETER.
3. DIMENSION D AND E DO NOT INCLUDE MOLD
PROTRUSION.
4. MAXIMUM MOLD PROTRUSION 0.15 PER SIDE.
5. DIMENSION B DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE DAMBAR
PROTRUSION SHALL BE 0.127 TOTAL IN EXCESS
OF THE B DIMENSION AT MAXIMUM MATERIAL
CONDITION.
MILLIMETERS
DIM MIN MAX
A 1.35 1.75
A1 0.10 0.25
B 0.35 0.49
C 0.19 0.25
D 4.80 5.00
E 3.80 4.00
e
1.27 BSC
H 5.80 6.20
h 0.25 0.50
L 0.40 1.25
θ 0˚
7˚
Advanced Clock Drivers Devices
Freescale Semiconductor
MPC94551
3