MPX5100A データシートの表示（PDF） - Freescale Semiconductor
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MPX5100A
Freescale Semiconductor
MPX5100A Datasheet PDF : 16 Pages
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7. Response Time is defined as the time for the incremental changed in the output to go from 10% to 90% of its final value when subjected to
a specified step change in pressure.
8. Warm-Up Time is defined as the time required for the product to meet the specified output voltage after the Pressure has been stabilized.
9. Offset Stability is the product’s output deviation when subjected to 1000 hours of Pulsed Pressure, Temperature Cycling with Bias Test.
ON-CHIP TEMPERATURE COMPENSATION, CALIBRATION AND SIGNAL CONDITIONING
Figure 2 shows the sensor output signal relative to
pressure input. Typical, minimum, and maximum output
curves are shown for operation over a temperature range of
0× to 85×C using the decoupling circuit shown in Figure 4.
The output will saturate outside of the specified pressure
range.
Figure 3 illustrates both the Differential/Gauge and the
Absolute Sensing Chip in the basic chip carrier (Case 867). A
fluorosilicone gel isolates the die surface and wire bonds from
the environment, while allowing the pressure signal to be
transmitted to the sensor diaphragm.
The MPX5100 series pressure sensor operating
characteristics, and internal reliability and qualification tests
are based on use of dry air as the pressure media. Media,
other than dry air, may have adverse effects on sensor
performance and long-term reliability. Contact the factory for
information regarding media compatibility in your application.
5
Vout = VS*(0.009*P+0.04)
± (Pressure Error * Temperature Factor * 0.009 * VS
4
VS = 5.0 V ± 0.25 Vdc
PE = 2.5
TM = 1
TEMP = 0 to 85°C
3
MAX
2
TYP
1
MIN
0
Pressure (kPa)
(Typ)
Offset
Figure 2. Output Vs. Pressure Differential
Fluorosilicone
Gel Die Coat
Die
Wire Bond
Stainless Steel
Metal Cover
Epoxy Plastic
Case
Fluorosilicone Gel
Die Coat
Die
Wire Bond
Stainless Steel
Metal Cover
Epoxy Plastic
Case
Lead Frame
Differential/Gauge Element
Die Bond
Lead Frame
Absolute Element
Die Bond
Figure 3. Cross Sectional Diagrams (Not to Scale)
Figure 4 shows the recommended decoupling circuit for
interfacing the output of the integrated sensor to the A/D input
of a microprocessor or microcontroller. Proper decoupling of
the power supply is recommended.
1.0 μF
0.01 μF
+5.0 V
VOUT
Vs
IPS
GND
OUTPUT
470 pF
Figure 4. Recommended Power Supply Decoupling and Output Filtering
(For additional output filtering, please refer to Application Note AN1646.)
Sensors
Freescale Semiconductor
MPX5100
3
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