MPX5100D データシートの表示（PDF） - Freescale Semiconductor

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MPX5100D

Integrated Silicon Pressure Sensor On-Chip Signal Conditioned, Temperature Compensated, and Calibrated

Freescale Semiconductor 

PRESSURE (P1)/VACUUM (P2) SIDE IDENTIFICATION TABLE

Freescale designates the two sides of the pressure sensor

as the Pressure (P1) side and the Vacuum (P2) side. The

Pressure (P1) side is the side containing fluoro silicone gel

which protects the die from harsh media. The MPX pressure

sensor is designed to operate with positive differential

pressure applied, P1 > P2.

The Pressure (P1) side may be identified by using Table 3

below.

TABLE 3. PRESSURE (P1)/VACUUM (P2) SIDE IDENTIFICATION TABLE

Part Number

MPX5100A, MPX5100D

MPX5100DP

MPX5100AP, MPX5100GP

MPX5100GSX

MPXV5100GC6U

MPXV5100GC7U

MPXV5100DP

MPXV5100GP

Case Type

867

867C

867B

867F

482A

482C

1351

1369

Pressure (P1) Side Identifier

Stainless Steel Cap

Side with Part Marking

Side with Port Attached

Side with Port Attached

Side with Port Attached

Side with Port Attached

Side with Part Marking

Side with Port Attached

INFORMATION FOR USING THE SMALL OUTLINE PACKAGE

MINIMUM RECOMMENDED FOOTPRINT FOR SURFACE MOUNTED APPLICATIONS

Surface mount board layout is a critical portion of the total

design. The footprint for the surface mount packages must be

the correct size to ensure proper solder connection interface

between the board and the package. With the correct

footprint, the packages will self align when subjected to a

solder reflow process. It is always recommended to design

boards with a solder mask layer to avoid bridging and

shorting between solder

Figure 5. Small Outline Package Footprint

MPX5100

6

Sensors

Freescale Semiconductor

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