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MR750RLG データシートの表示(PDF) - ON Semiconductor

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MR750RLG
ON-Semiconductor
ON Semiconductor ON-Semiconductor
MR750RLG Datasheet PDF : 7 Pages
1 2 3 4 5 6 7
MR750 SERIES
28
L = 1/8"
24
1/4"
20
16
3/8"
RESISTIVE INDUCTIVE
LOADS
BOTH LEADS TO HEAT
SINK WITH LENGTHS
AS SHOWN
12
5/8"
8.0
4.0
0
0 20 40 60 80 100 120 140 160 180 200
TL, LEAD TEMPERATURE (°C)
Figure 5. Maximum Current Ratings
32
CAPACITANCE LOADS
28
I(pk) = 5 Iavg
24
10 Iavg
20
20 Iavg
16
6F
1F & 3F
12
8.0
RESISTIVE − INDUCTIVE LOADS
4.0
0
0 4.0 8.0 12 16 20 24 28 32
IF(AV), AVERAGE FORWARD CURRENT (AMPS)
Figure 7. Power Dissipation
40
35
SINGLE LEAD TO HEAT SINK,
INSIGNIFICANT HEAT FLOW
30 THROUGH OTHER LEAD
25
20
15
10
BOTH LEADS TO HEAT
5.0
SINK, EQUAL LENGTH
0
0 1/8 1/4 3/8 1/2 5/8 3/4 7/8 1.0
L, LEAD LENGTH (INCHES)
Figure 8. Steady State Thermal Resistance
7.0
6.0
5.0
4.0
3.0
2.0
1.0
0
0
RqJA = 25°C/W
SEE NOTE
RESISTIVE INDUCTIVE LOADS
CAPACITANCE LOADS − 1F & 3F
I(pk) = 5 Iavg
I(pk) = 10 Iavg
I(pk) = 20 Iavg
RqJA = 40°C/W
SEE NOTE
f = 60 Hz
6F (IPK/IAVE = 6.28)
20 40 60 80 100 120 140 160 180 200
TA, AMBIENT TEMPERATURE (°C)
Figure 6. Maximum Current Ratings
NOTES
THERMAL CIRCUIT MODEL
(For Heat Conduction Through The Leads)
RqS(A)
RqL(A)
RqJ(A)
TA(A)
TL(A)
TC(A)
TJ
RqJ(K)
RqL(K)
RqS(K)
PF
TC(K)
TA(K)
TL(K)
Use of the above model permits junction to lead thermal resistance for
any mounting configuration to be found. Lowest values occur when one
side of the rectifier is brought as close as possible to the heat sink as
shown below. Terms in the model signify:
TA = Ambient Temperature
TC = Case Temperature
TL = Lead Temperature
TJ = Junction Temperature
RqS = Thermal Resistance, Heat Sink to Ambient
RqL = Thermal Resistance, Lead to Heat Sink
RqJ = Thermal Resistance, Junction to Case
PF = Power Dissipation
(Subscripts A and K refer to anode and cathode sides, respectively.)
Values for thermal resistance components are:
RqL = 40°C/W/in. Typically and 44°C/W/in Maximum.
RqJ = 2°C/W typically and 4°C/W Maximum.
Since RqJ is so low, measurements of the case temperature, TC, will be
approximately equal to junction temperature in practical lead mounted
applications. When used as a 60 Hz rectifierm the slow thermal response
holds TJ(PK) close to TJ(AVG). Therefore maximum lead temperature may
be found from: TL = 175°−RqJL PF. PF may be found from Figure 7.
The recommended method of mounting to a P.C. board is shown on the
sketch, where RqJA is approximately 25°C/W for a 1−1/2" x 1−1/2" copper
surface area. Values of 40°C/W are typical for mounting to terminal strips
or P.C. boards where available surface area is small.
ÉÉÉÉÉÉÉÉÉÉÉÉ Board Ground Plane
ÉÉÉÉRecommended mounting for half wave circuit
http://onsemi.com
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