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MSM6595A データシートの表示(PDF) - Oki Electric Industry

部品番号
コンポーネント説明
メーカー
MSM6595A
OKI
Oki Electric Industry OKI
MSM6595A Datasheet PDF : 13 Pages
1 2 3 4 5 6 7 8 9 10 Next Last
¡ Semiconductor
SOP24-P-430-1.27-K
MSM6595A-xxx
(Unit : mm)
Mirror finish
Notes for Mounting the Surface Mount Type Package
Package material
Lead frame material
Pin treatment
Solder plate thickness
Package weight (g)
Epoxy resin
42 alloy
Solder plating
5 mm or more
0.58 TYP.
The SOP, QFP, TSOP, TQFP, LQFP, SOJ, QFJ (PLCC), SHP, and BGA are surface mount type
packages, which are very susceptible to heat in reflow mounting and humidity absorbed in
storage. Therefore, before you perform reflow mounting, contact Oki’s responsible sales person
on the product name, package name, pin number, package code and desired mounting conditions
(reflow method, temperature and times).
10/12

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