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IS61NW6432 データシートの表示(PDF) - Integrated Silicon Solution

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IS61NW6432 Datasheet PDF : 13 Pages
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IS61NW6432
INTERLEAVED BURST ADDRESS TABLE (MODE = VCCQ or No Connect)
External Address
A1 A0
00
01
10
11
1st Burst Address
A1 A0
01
00
11
10
2nd Burst Address
A1 A0
10
11
00
01
3rd Burst Address
A1 A0
11
10
01
00
LINEAR BURST ADDRESS TABLE (MODE = GNDQ)
0,0
A1', A0' = 1,1
0,1
1,0
ABSOLUTE MAXIMUM RATINGS(1)
Symbol Parameter
Value
Unit
TBIAS
TSTG
PD
Temperature Under Bias
Storage Temperature
Power Dissipation
–10 to +85
°C
–55 to +150
°C
1.8
W
IOUT
Output Current (per I/O)
100
mA
VIN, VOUT Voltage Relative to GND for I/O Pins
–0.5 to VCCQ + 0.3 V
VIN
Voltage Relative to GND for
for Address and Control Inputs
–0.5 to 5.5
V
Notes:
1. Stress greater than those listed under ABSOLUTE MAXIMUM RATINGS may cause
permanent damage to the device. This is a stress rating only and functional operation
of the device at these or any other conditions above those indicated in the operational
sections of this specification is not implied. Exposure to absolute maximum rating
conditions for extended periods may affect reliability.
2. This device contains circuity to protect the inputs against damage due to high static
voltages or electric fields; however, precautions may be taken to avoid application of
any voltage higher than maximum rated voltages to this high-impedance circuit.
3. This device contains circuitry that will ensure the output devices are in High-Z at power
up.
8
Integrated Silicon Solution, Inc.
ADVANCE INFORMATION SR050-0B
07/15/98

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