MX25L1635DMI-10 データシートの表示（PDF） - Macronix International

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MX25L1635DMI-10

16M-BIT [x 1/x 2/x 4] CMOS SERIAL FLASH

Macronix International 

MX25L1635D

(17) Release from Deep Power-down (RDP), Read Electronic Signature (RES) ................................................. 22

(18) Read Electronic Manufacturer ID & Device ID (REMS), (REMS2), (REMS4) ............................................. 22

Table 7. ID Definitions ....................................................................................................................................... 23

(19) Enter Secured OTP (ENSO) ...................................................................................................................... 23

(20) Exit Secured OTP (EXSO) ........................................................................................................................ 23

(21) Read Security Register (RDSCUR) ........................................................................................................... 23

(22) Write Security Register (WRSCUR) ........................................................................................................... 24

Table 8. Security Register Definition ................................................................................................................. 24

POWER-ON STATE ................................................................................................................................................... 25

ELECTRICAL SPECIFICATIONS .............................................................................................................................. 26

Figure 2.Maximum Negative Overshoot Waveform ............................................................................................ 26

ABSOLUTE MAXIMUM RATINGS ................................................................................................................... 26

CAPACITANCE TA = 25° C, f = 1.0 MHz ........................................................................................................... 26

Figure 3. Maximum Positive Overshoot Waveform ............................................................................................ 26

Figure 5. OUTPUT LOADING .......................................................................................................................... 27

Figure 4. INPUT TEST WAVEFORMS AND MEASUREMENT LEVEL ............................................................. 27

Table 9. DC CHARACTERISTICS (Temperature = -40° C to 85° C for Industrial grade,VCC = 2.7V ~ 3.6V) ........ 28

Table 10. AC CHARACTERISTICS (Temperature = -40° C to 85° C for Industrial grade, VCC = 2.7V ~ 3.6V) .... 29

Figure 6. Serial Input Timing ............................................................................................................................. 30

Figure 7. Output Timing .................................................................................................................................... 30

Timing Analysis ....................................................................................................................................................... 30

Figure 8. WP# Setup Timing and Hold Timing during WRSR when SRWD=1 ..................................................... 31

Figure 9.Write Enable (WREN) Sequence (Command 06) ................................................................................ 31

Figure 10.Write Disable (WRDI) Sequence (Command 04) ............................................................................... 31

Figure 11. Read Identification (RDID) Sequence (Command 9F) ....................................................................... 32

Figure 12. Read Status Register (RDSR) Sequence (Command 05) ................................................................. 32

Figure 13. Write Status Register (WRSR) Sequence (Command 01) ................................................................ 32

Figure 14. Read Data Bytes (READ) Sequence (Command 03) ....................................................................... 33

Figure 15. Read at Higher Speed (FAST_READ) Sequence (Command 0B) .................................................... 33

Figure 16. 2 x I/O Read Mode Sequence (Command BB) ................................................................................. 34

Figure 17. 4 x I/O Read Mode Sequence (Command EB) ................................................................................. 34

Figure 18. 4 x I/O Read enhance performance Mode Sequence (Command EB) ............................................... 35

Figure 19. Page Program (PP) Sequence (Command 02) ................................................................................. 36

Figure 20. 4 x I/O Page Program (4PP) Sequence (Command 38) ................................................................... 36

Figure 21. Continously Program (CP) Mode Sequence with Hardware Detection (Command AD) ....................... 37

Figure 22. Sector Erase (SE) Sequence (Command 20) .................................................................................. 37

Figure 23. Block Erase (BE) Sequence (Command D8) ................................................................................... 37

Figure 24. Chip Erase (CE) Sequence (Command 60 or C7) ............................................................................ 38

Figure 25. Deep Power-down (DP) Sequence (Command B9) .......................................................................... 38

P/N: PM1374

REV. 1.5, OCT. 01, 2008

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