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NB100LVEP221FAG(2015) データシートの表示(PDF) - ON Semiconductor

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NB100LVEP221FAG
(Rev.:2015)
ON-Semiconductor
ON Semiconductor ON-Semiconductor
NB100LVEP221FAG Datasheet PDF : 12 Pages
First Prev 11 12
NB100LVEP221
PACKAGE DIMENSIONS
LQFP 52 EXPOSED PAD
CASE 848H
ISSUE B
SCALE 1:1
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
M
4 PL
M/2
AJ AJ
0.20 (0.008) T X-Y Z
Y14.5M, 1982.
2. CONTROLLING DIMENSION: MM.
3. DATUM PLANE “E" IS LOCATED AT BOTTOM OF
LEAD AND IS COINCIDENT WITH THE LEAD
−Z−
WHERE THE LEAD EXITS THE PLASTIC BODY AT
THE BOTTOM OF THE PARTING PLANE.
52
40
4. DATUM “X", “Y" AND “Z" TO BE DETERMINED AT
DATUM PLANE DATUM “E".
1
39
5. DIMENSIONS M AND L TO BE DETERMINED AT
SEATING PLANE DATUM “T".
6. DIMENSIONS A AND B DO NOT INCLUDE MOLD
PROTRUSION. ALLOWABLE PROTRUSION IS 0.25
−X−
L
L/2
PLATING
−Y−
AA
ÉÇÉÇÉÇÉÇ B
AB
ÉÉÇÇÉÉÇÇÉÉÇÇÉÉÇÇ B/2
D
BASE
METAL
J
REF
(0.010) PER SIDE. DIMENSIONS A AND B DO
INCLUDE MOLD MISMATCH AND ARE
DETERMINED AT DATUM PLAND “E".
7. DIMENSION D DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE DAMBAR
PROTRUSION SHALL NOT CAUSE THE LEAD
WIDTH TO EXCEED THE MAXIMUM D DIMENSION
BY MORE THAN 0.08 (0.003). DAMBAR CANNOT
BE LOCATED ON THE LOWER RADIUS OR THE
FOOT. MINIMUM SPACE BETWEEN PROTRUSION
AND ADJACENT LEAD OR PROTRUSION 0.07
(0.003).
13
27
0.08 (0.003) M Y T-U Z
MILLIMETERS
INCHES
14
26
A/2
DETAIL AJ−AJ
DIM MIN MAX
A 10.00 BSC
B 10.00 BSC
MIN MAX
0.394 BSC
0.394 BSC
A
0.20 (0.008) E X-Y Z
C 1.30 1.50 0.051 0.059
D 0.22 0.40 0.009 0.016
F 0.45 0.75 0.018 0.030
DETAIL AH
−E−
G
0.65 BSC
0.026 BSC
H
1.00 REF
0.039 BSC
J 0.09 0.20 0.004 0.008
K 0.05 0.20 0.002 0.008
−T− AG
SEATING
PLANE
G 48 PL
AG
0.10 (0.004) T
L 12.00 BSC
0.472 BSC
M 12.00 BSC
0.472 BSC
N
0.20 REF
0.008 REF
P
0_ 7_ 0 _ 7_
R
0 _ ---
0 _ ---
D 52 PL
0.08 (0.003) M T X-Y Z
V
0.05 (0.002) S
R
AC
S --- 1.70 --- 0.067
V
12 _REF
W
12 _REF
12 _REF
12 _REF
AA 0.20 0.35 0.008 0.014
AB 0.07 0.16 0.003 0.006
AC 0.08 0.20 0.003 0.008
AD
AD 4.58 4.78 0.180 0.188
EXPOSED PAD 14
26
SC
AE 4.58 4.78 0.180 0.188
13
27
AE
1
52
VIEW AG−AG
39
40
W
K
N
DETAIL AH
P
0.25
F
H
GAGE
PLANE
RECOMMENDED
SOLDERING FOOTPRINT
12.36
4.80
52X
1.18
4.80 12.36
PKG
OUTLINE
0.65
PITCH
www.onsemi.com
11
52X
0.40
DIMENSIONS: MILLIMETERS

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