NB100LVEP221
Table 7. LVNECL DC CHARACTERISTICS VCC = 0 V, VEE = −2.375 V to −3.8 V (Note 10)
−40°C
25°C
85°C
Symbol
Characteristic
IEE
Power Supply Current
VOH
Output HIGH Voltage (Note 11)
VOL
Output LOW Voltage (Note 11)
VIH
Input HIGH Voltage (Single−Ended)
VIL
Input LOW Voltage (Single−Ended)
VBB
Output Reference Voltage (Note 12)
VIHCMR
Input HIGH Voltage Common Mode
Range (Differential Configuration)
(Note 13)
CLK0/CLK0
CLK1/CLK1
Min Typ Max Min Typ Max Min Typ Max Unit
100 125 150 104 130 156 116 145 174 mA
−1145 −1020 −895 −1145 −1020 −895 −1145 −1020 −895 mV
−1945 −1820 −1600 −1945 −1820 −1600 −1945 −1820 −1600 mV
−1165
−880 −1165
−880 −1165
−880 mV
−1945
−1600 −1945
−1600 −1945
−1600 mV
−1525 −1425 −1325 −1525 −1425 −1325 −1525 −1425 −1325 mV
VEE + 1.2
VEE + 0.3
0.0
−0.9
VEE + 1.2
VEE + 0.3
0.0
−0.9
VEE + 1.2
VEE + 0.3
0.0 V
−0.9 V
IIH
Input HIGH Current
IIL
Input LOW Current
CLK 0.5
CLK −150
150
0.5
−150
150
0.5
−150
150 mA
mA
NOTE: Device will meet the specifications after thermal equilibrium has been established when mounted in a test socket or printed circuit
board with maintained transverse airflow greater than 500 lfpm.
10. Input and output parameters vary 1:1 with VCC.
11. All outputs loaded with 50 W to VCC−2.0 V.
12. Single−ended input operation is limited VEE ≤ −3.0V in NECL mode.
13. VIHCMR min varies 1:1 with VEE, VIHCMR max varies 1:1 with VCC. The VIHCMR range is referenced to the most positive side of the differential
input signal.
Table 8. HSTL DC CHARACTERISTICS VCC = 3.3 V; VEE = 0 V
0°C
25°C
85°C
Symbol
Characteristic
Min Typ Max
Min Typ Max
Min Typ Max Unit
VIH
Input HIGH Voltage
CLK1/CLK1 Vx+100
1600 Vx+100
1600 Vx+100
1600 mV
VIL
Input LOW Voltage
CLK1/CLK1 −300
VX
Differential Configuration Cross
680
Point Voltage
Vx−100
900
−300
680
Vx−100
900
−300
680
Vx−100 mV
900 mV
IIH
Input HIGH Current
IIL
Input LOW Current
CLK1
CLK1
−150
−150
−250
150 −150
−150
−250
150 −150
−150
−250
150 mA
mA
NOTE: Device will meet the specifications after thermal equilibrium has been established when mounted in a test socket or printed circuit
board with maintained transverse airflow greater than 500 lfpm.
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