NB100LVEP221(2003) データシートの表示（PDF） - ON Semiconductor
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NB100LVEP221 Datasheet PDF : 10 Pages
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NB100LVEP221
PACKAGE DIMENSIONS
LQFP 52 LEAD EXPOSED PAD PACKAGE
CASE 848H-01
ISSUE A
M
4 PL
M/2
-Z-
52
1
-X-
L
L/2
13
14
A/2
AJ AJ
40
39
27
26
0.20 (0.008) T X−Y Z
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: MM.
3. DATUM PLANE E" IS LOCATED AT BOTTOM OF
LEAD AND IS COINCIDENT WITH THE LEAD
WHERE THE LEAD EXITS THE PLASTIC BODY AT
THE BOTTOM OF THE PARTING PLANE.
4. DATUM X", Y" AND Z" TO BE DETERMINED AT
DATUM PLANE DATUM E".
PLATING
BASE 5. DIMENSIONS M AND L TO BE DETERMINED AT
METAL
SEATING PLANE DATUM T".
-Y-
B
ABÉÉÇÇÉÉÇÇAAÉÉÇÇÉÉÇÇJ
6. DIMENSIONS A AND B DO NOT INCLUDE MOLD
PROTRUSION. ALLOWABLE PROTRUSION IS 0.25
(0.010) PER SIDE. DIMENSIONS A AND B DO
INCLUDE MOLD MISMATCH AND ARE
DETERMINED AT DATUM PLAND E".
7. DIMENSION D DOES NOT INCLUDE DAMBAR
B/2
D
REF
PROTRUSION. ALLOWABLE DAMBAR
PROTRUSION SHALL NOT CAUSE THE LEAD
WIDTH TO EXCEED THE MAXIMUM D DIMENSION
BY MORE THAN 0.08 (0.003). DAMBAR CANNOT
0.08 (0.003) M Y T−U Z
BE LOCATED ON THE LOWER RADIUS OR THE
FOOT. MINIMUM SPACE BETWEEN PROTRUSION
AND ADJACENT LEAD OR PROTRUSION 0.07
DETAIL AJ-AJ
(0.003).
MILLIMETERS
INCHES
A
DETAIL AH
0.20 (0.008) E X−Y Z
DIM MIN MAX MIN MAX
A 10.00 BSC
0.394 BSC
B 10.00 BSC
0.394 BSC
C 1.30 1.50 0.051 0.059
-E-
D 0.22 0.40 0.009 0.016
F 0.45 0.75 0.018 0.030
-T- AG
SEATING
PLANE
G 48 PL
AG
0.10 (0.004) T
G
0.65 BSC
0.026 BSC
H
1.00 REF
0.039 BSC
J 0.09 0.20 0.004 0.008
K 0.05 0.20 0.002 0.008
L
12.00 BSC
0.472 BSC
EXPOSED PAD 14
13
D 52 PL
0.08 (0.003) M T X−Y Z
AD
26
SC
27
V
0.05 (0.002) S
R
AC
M 12.00 BSC
0.472 BSC
N
0.20 REF
0.008 REF
P 0_ 7_ 0 _ 7_
R
0 _ −−−
0 _ −−−
S −−− 1.70 −−− 0.067
V
12 _REF
W
12 _REF
12 _REF
12 _REF
AA 0.20 0.35 0.008 0.014
AB 0.07 0.16 0.003 0.006
AC 0.08 0.20 0.003 0.008
AD 4.58 4.78 0.180 0.188
AE 4.58 4.78 0.180 0.188
W
K
N
P
0.25
F
GAGE
AE
H
PLANE
DETAIL AH
1
52
VIEW AG-AG
39
40
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